CM21232768DZFT

Series:	CM212
Packaging:	Tape & Reel (TR)
Part Status:	Obsolete
Type:	kHz Crystal (Tuning Fork)
Frequency:	32.768kHz
Frequency Stability:	--
Frequency Tolerance:	±20ppm
Load Capacitance:	12.5pF
ESR (Equivalent Series Resistance):	90 kOhms
Operating Mode:	Fundamental
Operating Temperature:	-40°C ~ 85°C
Ratings:	--
Mounting Type:	Surface Mount
Package / Case:	2-SMD, No Lead
Size / Dimension:	0.079" L x 0.047" W (2.00mm x 1.20mm)
Height - Seated (Max):	0.024" (0.60mm)

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Crystals

Crystals are solid materials that feature an orderly atomic structure with a periodicity of the simplest unit of one or more dimensions. This periodicity of unit can extend thus forming planes and directions and the entire crystal structure can be repeated in three dimensional space indefinitely. Each atomic unit and its surrounding environment are bonded together in a very stable form because of this ordered arrangement. Crystals have been used in varied fields and technologies, including CM21232768DZFT.

CM21232768DZFT Application Field:

CM21232768DZFT(High Precision Dicing Ultrasonic Cutter)is a controlled-crystal solid-state laser for material processing. It is designed to cut and ablate the surface layers of various materials including semiconductor, metals, glass, ceramics, and plastics. The application fields of CM21232768DZFT are mainly in medical and automotive industry, optical industry, and electrical circuit board industry.In medical industry, CM21232768DZFT is mostly used for surface ablation of implants, tissue ablation, coagulation and tissue dissection. In automotive industry, it is used for cutting metals and alloys in a very precise and controlled manner. In optical industry, it is used for precision cutting and ablation of crystalline materials such as glass and optical ceramic. In electrical circuit board industry, it is used for cutting and engraving pattern and texts as well as ablation of thin films.

CM21232768DZFT Working Principle:

CM21232768DZFT works on the principle of ultrasonic frequency acoustic vibration technology. It generates ultra-high frequency (MHz frequency) acoustic vibration energy on the cutting edge of the blade which then mechanically agitates the material to cut or ablate the material at different depths in a very precise and controlled manner. Through this mechanism, ultra-thin and flat surfaces can be generated on the materials while minimal mechanical pressure is applied.The unique features of CM21232768DZFT ultrasonic cutting systems are linear drive oscillation, dual-surface oscillation and separate chip disposal containment systems. These features make it suitable for cutting the toughest of materials such as semiconductors, aluminium alloy, glass, ceramics and plastics.The unique features such as high efficiency, easy operation, wide application and stable performance make CM21232768DZFT ultrasonic cutting systems suitable for a wide range of applications. It is used in a variety of fields due to its flexibility, accuracy, and speed in cutting or ablating materials. It is also gaining popularity for its ability to cut high-density materials such as semiconductors, aluminium alloy, glass, ceramics and plastics in a very precise manner with minimal mechanical pressure applied.

Conclusion:

CM21232768DZFT is an ultrasonic cutting system with a high precision, easy operation and wide application. It works on the principle of ultrasonic frequency acoustic vibration technology to cut and ablate the surface layers of various materials. It is suitable for cutting the toughest of materials such as semiconductors, aluminium alloy, glass, ceramics and plastics. It is used in medical and automotive industry, optical industry, and electrical circuit board industry. With its unique features, CM21232768DZFT is gaining popularity for its ability to cut high-density materials in a precise and controlled manner while minimizing mechanical pressure.

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