DA-T263-101E-TR Fans, Thermal Management |
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Allicdata Part #: | DA-T263-101ETR-ND |
Manufacturer Part#: |
DA-T263-101E-TR |
Price: | $ 1.17 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | TO-263 HEAT SINK / POLY TAPE |
More Detail: | Heat Sink TO-263 (D²Pak) Aluminum 2.0W @ 30°C Top ... |
DataSheet: | DA-T263-101E-TR Datasheet/PDF |
Quantity: | 1000 |
250 +: | $ 1.05840 |
500 +: | $ 1.02312 |
1250 +: | $ 0.91728 |
6250 +: | $ 0.89964 |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Series: | D |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-263 (D²Pak) |
Attachment Method: | Solderable Feet |
Shape: | Rectangular, Fins |
Length: | 0.500" (12.70mm) |
Width: | 1.020" (25.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.400" (10.16mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
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The DA-T263-101E-TR is a thermal heat sink, designed to dissipate and dissipate heat from electrical circuits. It is typically used in high-duty industrial applications such as solar cells, compact photovoltaic, power LED lighting, and other high-power applications. The heat sink is designed with a thermally conductive fins attached to a mounting plate. The mounting plate also has an insulating access that serves to further retard the transmission of heat.
The DA-T263-101E-TR has a high thermal efficiency, in that it is able to dissipate and remove a large amount of heat from the circuit in short time. This is especially important in applications where the electrical load is high and the ability to dissipate large amounts of heat quickly is important. This type of heat sink also provides superior protection of the circuit from shock and vibration, reducing the risk of electrical overload and damage to the circuit.
The DA-T263-101E-TR is made of a combination of metal alloys for excellent heat conduction and durability. It is designed with a specifically designed aluminum fin array for higher heat transfer, and low air flow resistance. The aluminum fin array also allows for superior heat dissipation even when the air flow is limited.
The DA-T263-101E-TR also has a high heat sink base plate, made of a combination of metals for superior heat dissipation and durability. The base plate is designed to distribute the heat evenly and increase the heat dissipation area. This heat sink is typically used in compact photovoltaic, and other high-power applications.
The DA-T263-101E-TR is an efficient and economical heat sink, and is designed to provide a reliable and reliable thermal solution. This type of heat sink is a great choice for industrial and commercial applications where the need for a reliable, low-cost thermal solution is required.
The specific data is subject to PDF, and the above content is for reference