DA-T263-101E Allicdata Electronics
Allicdata Part #:

DA-T263-101E-ND

Manufacturer Part#:

DA-T263-101E

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Ohmite
Short Description: HEATSINK FOR TO-263 BLACK
More Detail: Heat Sink TO-263 (D²Pak) Aluminum 2.0W @ 30°C Top ...
DataSheet: DA-T263-101E datasheetDA-T263-101E Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: D
Part Status: Discontinued at Digi-Key
Type: Top Mount
Package Cooled: TO-263 (D²Pak)
Attachment Method: Solderable Feet
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Width: 1.020" (25.91mm)
Diameter: --
Height Off Base (Height of Fin): 0.400" (10.16mm)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The DA-T263-101E is a highly advanced thermal-heat sink which is designed to provide thermal performance for a wide range of applications. This thermal-heat sink makes use of advanced designs to ensure maximum efficiency in heat dissipation and to maintain stable operating temperatures for the sensitive components contained in the application. The unit is also capable of maintaining temperatures near ambient, providing reliable thermal performance without compromising power or efficiency. The DA-T263-101E is a great choice for applications that require high thermal performance or maximum thermal efficiency.

The highly advanced design of the DA-T263-101E involves multiple layers of ribs which allow for maximum thermal efficiency by ensuring proper heat dissipation. These fins are designed to create a more evenly distributed spread of air across the entire surface of the heat sink. This helps to ensure that the sensitive components contained within the application remain cool and stable under all operating conditions. Additionally, the multiple layers of fins create an air cushion which helps to reduce the temperature of the heat sink, as well as the application’s operational temperature.

The DA-T263-101E also has certain unique features which make it a great choice for applications which require a high level of efficiency and cooling performance. The cooling fins are designed to maximize the amount of air that can be dissipated from the application, and this helps to ensure that the processor or other components are kept at the correct temperature for optimal performance. Additionally, the fins are designed to maximize the air flow through the heat sink, which helps to ensure that the application is able to dissipate heat more efficiently than traditional heat sink designs.

The DA-T263-101E is designed to be used in a wide range of applications which require a reliable source of thermal management. These applications can range from high power processors to low power applications, and the unit can be used to maximize the thermal efficiency of any type of application. Additionally, the unit is also capable of providing reliable thermal performance in high power applications where thermally demanding components are required. The unit is also very easy to install, and can be used in a wide range of applications. As such, the DA-T263-101E is a great choice for any thermal management needs.

The DA-T263-101E thermal-heat sink is an excellent choice for any application that requires reliable thermal performance and cooling capabilities. The advanced design of the DA-T263-101E ensures maximum efficiency in dissipating heat, while also allowing for a more stable operating temperature for the application. Additionally, the advanced ribs and air cushioning design also ensure maximum air flow through the heat sink and allow for more efficient cooling performance. As such, the DA-T263-101E is a great choice for any application requiring reliable thermal-heat sink performance.

The specific data is subject to PDF, and the above content is for reference

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