
DA-T263-201E-TR Fans, Thermal Management |
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Allicdata Part #: | DA-T263-201ETR-ND |
Manufacturer Part#: |
DA-T263-201E-TR |
Price: | $ 1.13 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | HEATSINK FOR TO-263 |
More Detail: | Heat Sink TO-263 (D²Pak) Aluminum 2.0W @ 30°C Top ... |
DataSheet: | ![]() |
Quantity: | 1000 |
200 +: | $ 1.02816 |
400 +: | $ 0.96768 |
600 +: | $ 0.90720 |
1000 +: | $ 0.84672 |
5000 +: | $ 0.81648 |
Specifications
Series: | D |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-263 (D²Pak) |
Attachment Method: | Solderable Feet |
Shape: | Rectangular, Fins |
Length: | 0.500" (12.70mm) |
Width: | 1.020" (25.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.480" (12.19mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Description
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Thermal - Heat sinks are used to dissipate heat generated by a component or device to the air. The DA-T263-201E-TR is a thermal heat sink that is widely used in applications such as aerospace, automotive, and industrial.
Heat Sink Application Field and Working Principle of DA-T263-201E-TR
The DA-T263-201E-TR is a thermal heat sink that functions by absorbing and dissipating heat from a heat source, which could be an IC chip, a processor, etc. The heat is first absorbed by the thermal fins, then dissipated to the air by convection and conduction. This type of technology is known as “heat pipe based” and is used in many thermal applications.
This thermal heat sink has a wide range of applications, mostly in the aerospace, automotive and industrial sectors. The aerospace industry uses the DA-T263-201E-TR on high-end military and commercial systems. In the automotive industry, it is used to cool the engines and other components of vehicles. Industrial applications include machine tooling, electronics and other sensitive equipment that require efficient cooling.
The DA-T263-201E-TR thermal heat-sink consists of three main components: a heat source, a finned aluminum base, and heat pipes. The heat source can be either a CPU, a GPU or any other component that produces heat. The finned base provides the thermal interface between the heat source and the heat pipes. Heat pipes are hollow tubes filled with a special liquid which is responsible for transferring the heat away from the heat source to the air.
The thermal fins of the DA-T263-201E-TR are designed to maximize the heat-transfer surface area and provide a larger dissipation area than other traditional cooling solutions. The fins are also designed with a certain degree of airflow restriction which ensures that the thermal fins do not exceed their maximum operating temperature.
The DA-T263-201E-TR uses high-end surface treatment technology to enhance the thermal dissipation efficiency of the heat sink. This process involves chemical molding, anodic oxidation, and shot peening to give the surface a uniform finish and smooth texture. This processhelps to reduce the number of defects, as well as reduce the thermal resistance between the base and fins.
The DA-T263-201E-TR utilizes a patented v-shaped profile heat-pipe technology to ensure efficient cooling. The v-shaped design not only maximizes the surface area but also provides high efficiency propagation of heat to the thermal fins.
The DA-T263-201E-TR also features a fan-less design, allowing it to operate without any noise or vibration. This design is ideal for applications where noise and vibration can be unwanted. It is also versatile in that it can be used in both vertical and horizontal orientations, allowing its use in a variety of applications.
In conclusion, the DA-T263-201E-TR is an effective thermal heat sink that is used in many different industries. It has a wide range of applications and is designed to maximize the surface area and heat-transfer efficiency. Additionally, it features a quiet, fan-less design and can be used in both vertical and horizontal orientations.
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