| Allicdata Part #: | DA-T263-401E-TR-ND |
| Manufacturer Part#: |
DA-T263-401E-TR |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | TO-263 SMD HEAT SINK ANODZD |
| More Detail: | Heat Sink TO-263 (D²Pak) Aluminum Top Mount |
| DataSheet: |  DA-T263-401E-TR Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | D |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-263 (D²Pak) |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.030" (26.16mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.460" (11.68mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - heat sinks are designed to maintain the functionality of components within a temperature-regulated environment. The DA-T263-401E-TR is one such example of a thermal-heat sink that utilizes technology to maximum efficiency and performance.
The DA-T263-401E-TR is a high-powered, high-performance thermal-heat sink available for application in a broad spectrum of devices and situations. It is constructed from aluminum-clad copper, with an anodized aluminum fin surface. It also features a special adhesive-backed thermal pad, ensuring better heat conduction and protection of the components.
The DA-T263-401E-TR is designed with a heat pipe system, allowing for a dual-sided, uniform temperature distribution. It helps to reduce air gaps in the heat sink, improving performance and reliability. The heat sink also features a built-in fan, ensuring air circulation and a lower level of noise.
The DA-T263-401E-TR has several advantageous features that make it an ideal choice for a wide range of applications. Its compact design makes it suitable for installation in tight spaces, while the low profile and thermally conductive base make it more efficient at dissipating heat. Its energy-saving design also helps to reduce power consumption.
The working principle of the DA-T263-401E-TR thermal-heat sink is simple. Heat is generated by the component that the heat sink is protecting and is transferred via conduction, convection, or radiation. Heat is then moved away from the component by the heat sink and is dissipated in to the surrounding air. The speed of the fan helps to increase the amount of air flow over the component, ensuring efficient cooling.
The primary application field of the DA-T263-401E-TR thermal-heat sink is in embedded and industrial computing. It is ideal for use with electric motors, power supplies, controllers, and other electronic components. It is designed to provide optimal thermal management for use in high temperature environments, such as data centers, extreme gaming, and other intensive applications.
The DA-T263-401E-TR is a thermal-heat sink that utilizes advanced technology to deliver maximum performance. It features a compact design, a low-profile, and advanced heat pipe and fan system, ensuring energy savings and improved cooling efficiency. Its primary application field is in embedded and industrial computing, with optimal performance in high-temperature situations.
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