DA-T268-101E-TR

Series:	D
Part Status:	Active
Type:	Top Mount
Package Cooled:	TO-268 (D³Pak)
Attachment Method:	Solderable Feet
Shape:	Rectangular, Fins
Length:	0.500" (12.70mm)
Width:	1.220" (30.99mm)
Diameter:	--
Height Off Base (Height of Fin):	0.400" (10.16mm)
Power Dissipation @ Temperature Rise:	5.0W @ 35°C
Thermal Resistance @ Forced Air Flow:	6.00°C/W @ 600 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Thermal - Heat Sinks are devices that conduct thermal energy away from hot components and dissipate it into the environment. Heat sinks are used in a variety of applications and products where heat must be quickly dissipated due to electronic components over-heating.The DA-T268-101E-TR is a type of heat sink used in thermal management of computer hardware, such as sensors and other thermal systems. This heat sink uses an array of fins and passive technology, incorporating integrated design features to create thermal performance that is highly efficient and reliable.

Application Field of DA-T268-101E-TR

The DA-T268-101E-TR heat sink is a high-performance solution for a number of applications where precise temperature control is important. It is specifically designed for the thermal management of high temperature electronics, such as microprocessors, graphics cards and other components.The heat sink also has a unique profile and geometry that allows it to be integrated directly into printed circuit boards in a variety of layouts, which eliminates additional components and improves airflow. It also has an array of small fins which provide excellent thermal dissipation and helps to ensure long-term component performance.The heat sink is well-suited for a variety of applications such as computers, servers, embedded systems, LED lighting, smart home devices, military applications, and automotive electronics.

Working Principle of DA-T268-101E-TR

The DA-T268-101E-TR heat sink works by transferring the thermal energy away from the component and dissipating it into the environment. The heat sink consists of an array of finned areas which help to dissipate the heat from the components.When the heat is generated by the component, it is conducted through the thermal paste and transferred to the heat sink, where it is dissipated into the environment. The shape of the heat sink helps to increase the surface area, which increases the rate at which the heat is dissipated away from the component.The heat sink also has an integrated design feature which helps to improve thermal performance and reliability. This feature allows the heat to be more evenly distributed across the entire heat sink, increasing the time for efficient cooling of the component.

Conclusion

The DA-T268-101E-TR heat sink is a high performance solution for thermal management. It has an array of small fins which provide excellent thermal dissipation and help to ensure long term component performance. The heat sink is also well suited for a variety of applications and has an integrated design feature which ensures improved thermal performance. This makes the DA-T268-101E-TR a great choice for any thermal management application.

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