DA-T268-301E-TR Fans, Thermal Management |
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| Allicdata Part #: | DA-T268-301ETR-ND |
| Manufacturer Part#: |
DA-T268-301E-TR |
| Price: | $ 1.50 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | HEATSINK FOR TO-268 |
| More Detail: | Heat Sink TO-268 (D³Pak) Aluminum 7.0W @ 35°C Top ... |
| DataSheet: |  DA-T268-301E-TR Datasheet/PDF |
| Quantity: | 10200 |
| 200 +: | $ 1.36080 |
| 400 +: | $ 1.27575 |
| 600 +: | $ 1.23322 |
| 1000 +: | $ 1.10565 |
| 5000 +: | $ 1.08439 |
| Series: | D |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-268 (D³Pak) |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.580" (40.13mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.460" (11.68mm) |
| Power Dissipation @ Temperature Rise: | 7.0W @ 35°C |
| Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 700 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal – Heat Sinks
Heat Sinks are important devices used in many electronic applications to pass heat from one component to another. They are commonly used in an effort to keep components cool and prevent them from excessive heat damage or failure. Heat Sinks are typically used to reduce the temperature of transistors, power supplies, resistors, and other electronic components.
Thermal - Heat Sinks, specifically, work to dissipate heat through either air or liquid-cooled systems that incorporate fans or liquid coolants. Heat sinks utilize a materials thermal properties, such as conduction, convection, and radiative heat transfer, to dissipate heat away from the hot spot and spread it out so that no component is under crisis with too much heat.
The model DA-T268-301E-TR is a particularly effective Heat Sink with enhanced thermal performance. It features a flat top fin structure which enables air to flow through the heat sink with minimized air resistance. It also has an optimal fin density of 86 fins per inch and a 9.5mm fin pitch, providing enhanced thermal performance.
The DA-T268-301E-TR works on the idea of convection heat sinks; it transfers the heat absorbed by the heat sink and dissipates it into the surrounding air. This is done by the heat sink increasing the existing air velocity around the component and having wider channels that allow for greater air currents. By increasing air circulation, the heat sink increases the rate at which heat is removed from the component and into the surrounding air.
In addition, the DA-T268-301E-TR features two different contact surface types – locked and slide. The slide surface is typically used with components with a higher wattage, while the Locked-in surface is used for lower wattage components. Both contact surfaces allow for easy installation and improved thermal performance. The DA-T268-301E-TR also features a wide variety of mounting options, such as VESA (Video Electronics Standards Association), Computex and Windows. This ensures compatibility with nearly all types of PC components.
The DA-T268-301E-TR is a highly efficient and reliable thermal-heat sink with many advantages over other, less efficient heat sinks. It offers improved heat dissipation and reduced temperatures, allowing components to operate in cooler conditions. In addition, it is designed with various mounting possibilities, allowing for easy installation with many different components. Finally, the flat top fin structure on the DA-T268-301E-TR helps make air flow easier, making it more efficient and cost-effective.
The specific data is subject to PDF, and the above content is for reference