DA-T268-401E-TR Allicdata Electronics
Allicdata Part #:

DA-T268-401E-TR-ND

Manufacturer Part#:

DA-T268-401E-TR

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Ohmite
Short Description: TO-268 SMD HEAT SINK ANODZD
More Detail: Heat Sink TO-268 (D³Pak) Aluminum Top Mount
DataSheet: DA-T268-401E-TR datasheetDA-T268-401E-TR Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: D
Part Status: Active
Type: Top Mount
Package Cooled: TO-268 (D³Pak)
Attachment Method: Solderable Feet
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Width: 1.220" (30.99mm)
Diameter: --
Height Off Base (Height of Fin): 0.460" (11.68mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal management of electronics applications has become an important factor that must be taken into consideration. It can become a major factor to consider when designing a system, as heat build-up can be detrimental to the system’s reliability. Heat sinks are used to help dissipate the heat that builds up in electronic components, and the DA-T268-401E-TR is one such device used in thermal management. This article will give an overview of the application field and working principle of the DA-T268-401E-TR.

The DA-T268-401E-TR is a small, light heat sink intended for use in electronic devices, such as microprocessors, printed circuit boards, and other applications where heat needs to be dissipated. It has an aluminum structure and is equipped with a fan. The fan helps to move air across the heat sink, further increasing its thermal performance. The heat sink measures 67.5 x 67.5 x 10mm and has a total weight of around 40g.

This heat sink is very efficient at transferring heat away from the component it is attached to. Its high performance is due to its design. It has a unique combination of high efficient aluminum fins with a specially designed fan, providing superior cooling performance and reliability. The fan is designed to rotate at high speed, creating an air flow that helps to dissipate the heat more quickly. Additionally, its lightweight construction means that it can be installed almost anywhere, without worrying about adding too much weight or taking up too much space.

The DA-T268-401E-TR is an excellent choice for thermal management in various applications. Its slim profile and light weight makes it perfect for use in small, enclosed spaces. It is also suitable for use in high-temperature environments, as its efficient cooling performance can help keep temperatures stable. Additionally, its versatile design makes it easy to install, and it is ideal for use in applications where space is limited.

The working principle of the DA-T268-401E-TR is relatively simple. It uses the convection-conductance of air to dissipate heat away from the component to which it is attached. Heat is conducted through the heat sink structure to the fan, which then distributes the heat outward in the form of air. This air flow helps to reduce the temperature of the component, preventing it from becoming too hot and possibly damaging it.

In conclusion, the DA-T268-401E-TR is an ideal choice for thermal management applications. Its slim and lightweight design makes it well-suited for a wide range of applications. Additionally, its efficient cooling performance and easy installation process makes it the perfect choice for any thermal management task. Lastly, its working principle is based on the convection-conductance of air, providing superior heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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