DF12(5.0)-60DP-0.5V(86) Allicdata Electronics
Allicdata Part #:

H5006TR-ND

Manufacturer Part#:

DF12(5.0)-60DP-0.5V(86)

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN HEADER 60POS 0.5MM SMD GOLD
More Detail: 60 Position Connector Header, Outer Shroud Contact...
DataSheet: DF12(5.0)-60DP-0.5V(86) datasheetDF12(5.0)-60DP-0.5V(86) Datasheet/PDF
Quantity: 5000
Stock 5000Can Ship Immediately
Specifications
Series: DF12
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header, Outer Shroud Contacts
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Board Guide, Solder Retention
Contact Finish: Gold
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 5mm
Height Above Board: 0.169" (4.30mm)
Description

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DF12(5.0)-60DP-0.5V(86) is a type of rectangular connector that belongs to the Arrays, Edge Type, Mezzanine (Board to Board) category. It is characterized by its size and its high-speed transmission capabilities, making it a suitable choice for applications that require reliable connections.This particular type of connector has a 5mm pitch and 60 pins, with a voltage rating of 0.5V. It is commonly used in various high-performance applications for inter-board connections, including FPGAs, microprocessors, and microcontrollers. Its size and low profile also make it suitable for applications where board space is limited.The DF12(5.0)-60DP-0.5V(86) is designed with a two-piece shell construction that provides excellent protection against dust and other environmental contamination. The speed of the transmission is impressive, reaching up to 6 Gbps, enabling high-speed data transmission. It also features improved crosstalk levels and signal integrity, allowing for reliable reading and writing of data.The connector’s mating features consist of a unique high retention latch system and an insulation displacement connection (IDC). The latch system helps to ensure that the connection is secure, while the IDC simplifies the mating process and ensures a lower rate of crosstalk.The DF12(5.0)-60DP-0.5V(86) requires less airflow to achieve heat dissipation, making it suitable for thermal management applications. It is also designed to withstand high vibration and shock loads.The DF12(5.0)-60DP-0.5V(86) is suitable for a wide range of applications including automotive, consumer electronics, industrial equipment, communications, and medical equipment. Its features and capabilities make it a reliable option for applications that require high speed and reliability. Its small size makes it particularly useful when board space is limited, and its reliability ensures that there are no disrupted connections.

The specific data is subject to PDF, and the above content is for reference

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