DF12C(3.0)-20DS-0.5V(81)

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) has frequently been chosen for use in a variety of applications. An example is DF12C(3.0)-20DS-0.5V(81). This type of connector includes features and applications that make it an optimal choice in certain situations.

DF12C(3.0)-20DS-0.5V(81) is a surface-mount rectangular connector array assembled with a soldered edge. It consists of two independent components, the substrate and the contacting module. The contacting module can be made either with stamped and formed contacts or with machined terminal contacts, depending on the desired design requirements.

Its high-density construction makes DF12C(3.0)-20DS-0.5V(81) highly suitable for applications requiring a small footprint and high degree of board-to-board connection. Its small size also allows it to fit into narrow spaces, making it an optimal choice for applications requiring tight spaces. Furthermore, its simple design eliminates potential signal reflections that occur in some other types of connectors.

The situation in which DF12C(3.0)-20DS-0.5V(81) is particularly advantageous is its optimal use in board stacking applications. This type of connector has the ability to connect two boards vertically or horizontally at the same level or different levels. This allows for maximum flexibility in the design of multiple board solutions such as network switches, power supplies, communication devices, and computers.

The contacts are also designed to eliminate the crosstalk between the conductors for reliable electrical signal transmission. In addition, the built-in stoppers assure the correct mating of the connectors and prevent unreliable connections. The connector modules also have built-in shields to reduce electromagnetic interference (EMI).

Furthermore, this type of application field and working principle is supported by a wide range of insulation materials and surface finishes, in order to meet various environmental requirements in industrial, military, and medical fields. This includes a range of protection classes such as IP67 and REACH compliance.

In summary, DF12C(3.0)-20DS-0.5V(81) is an ideal choice for applications and working principles involving tight spaces, board stacking ground plane, connectivity solutions, and electromagnetic interference protection. Its advantageous features include a small footprint, high-density construction, simplified design, and wide range of insulation materials and surface finishes.

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