DF17(3.0)-60DS-0.5V(57)

Series:	DF17
Packaging:	Tape & Reel (TR)
Part Status:	Active
Connector Type:	Receptacle, Center Strip Contacts
Number of Positions:	60
Pitch:	0.020" (0.50mm)
Number of Rows:	2
Mounting Type:	Surface Mount
Features:	Board Guide, Solder Retention
Contact Finish:	Gold
Contact Finish Thickness:	--
Mated Stacking Heights:	5mm, 5.5mm, 7mm
Height Above Board:	0.138" (3.50mm)

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DF17(3.0)-60DS-0.5V(57) is a type of rectangular connector arrays, used primarily for edge-type board-to-board applications. It consists of a pair of mated connector assemblies, one male and one female, which can be used to join two printed circuit boards together. The DF17 family of connectors has become a popular choice for interboard connections due to its high reliability, small size and low cost. It is especially well suited for applications where space is at a premium, such as consumer electronics and telecommunications equipment.The male DF17 connector assembly is designed to plug into the female connector. It consists of a base, a cover, and two headers with contact pins. The two headers are inserted into the base, which provides strain relief for the pins. The cover locks the headers in place, and prevents any damage to the contacts. The headers are rated for 0.2 to 0.5 A and 60 VDC, and can be used with single- or double-row boards.The female connector assembly is designed to be mounted on the printed circuit board. It consists of a housing, two shrouds, and two latch pins. The housing accepts the male connectors and provides strain relief for the pins. The two shrouds are inserted into the housing, which locks them into place. The two latch pins are used to secure the male connector, and provide a secure connection between the two boards.The DF17(3.0)-60DS-0.5V(57) connector assembly is designed to be used in a wide variety of edge-type board-to-board applications. Its small size and high reliability make it an ideal choice for consumer electronics and telecommunications equipment. Its low cost and wide availability make it the ideal choice for prototyping and low volume applications. Its small form factor also makes it perfect for applications where space is at a premium.

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