DF17B(1.0H)-60DP-0.5V(57) Allicdata Electronics
Allicdata Part #:

DF17B(1.0H)-60DP-0.5V(57)-ND

Manufacturer Part#:

DF17B(1.0H)-60DP-0.5V(57)

Price: $ 0.78
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN HDR 60POS .5MM SMD GOLD
More Detail: 60 Position Connector Header, Outer Shroud Contact...
DataSheet: DF17B(1.0H)-60DP-0.5V(57) datasheetDF17B(1.0H)-60DP-0.5V(57) Datasheet/PDF
Quantity: 1000
1000 +: $ 0.70875
Stock 1000Can Ship Immediately
$ 0.78
Specifications
Series: DF17
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header, Outer Shroud Contacts
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Solder Retention
Contact Finish: Gold
Contact Finish Thickness: --
Mated Stacking Heights: 4mm
Height Above Board: 0.130" (3.30mm)
Description

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The DF17B(1.0H)-60DP-0.5V(57) is a part of a high-density rectangular array edge-type interconnect system used in commercial and industrial applications. This type of interconnect system is a high-performance, low-profile option that offers a dense array of power and signal contacts for reliable circuit board-to-PCB interconnects. It is an ideal choice for applications where board density and high performance are required.

The DF17B(1.0H)-60DP-0.5V(57) has an array of 60 power and signal contacts arranged in a single row. This edge-type mezzanine interconnect system offers a 0.5mm pitch and is designed to support board-to-board connections of 2.9mm and 4.2mm minimum height profiles. The connector houses three power pins per row with power ratings of up to 1A current. The connector also provides a shielding option to protect against EMI. The D-sub connectors are designed for high mounting flexibility and are available with a variety of mounting styles.

The DF17B(1.0H)-60DP-0.5V(57) rectangular array edge-type interconnect system is an ideal solution for applications such as industrial equipment, telecommunications, wired communication systems, medical imaging, motor control, and power conversion. Its high-density performance allows for a high number of power and signal contacts in a single system that is also low-profile and easy to install. The system is also designed to support a variety of mounting styles, including board-edge and board-to-board connections. The DF17B(1.0H)-60DP-0.5V(57) interconnect system is well suited for high-density, high-performance applications that require flexibility and reliable performance.

The working principle of the DF17B(1.0H)-60DP-0.5V(57) interconnect system is relatively straightforward. When the system is connected, the power contacts carry a current amount, depending on the application\'s current ratings, from one side of the board to the other. This current is then transferred through the D-submale and female assemblies, which provide a reliable coupling of the connection. The signal contacts then provide the connections for the passing of digital signals, such as from an analog-to-digital converter, from one side of the board to the other. The two components of the system, the power and signal contacts, work together to provide a reliable and efficient connection between the two sides of the board.

The specific data is subject to PDF, and the above content is for reference

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