DF23C-14DS-0.5V(53)

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The DF23C-14DS-0.5V(53) is a rectangular connector from the Arrays, Edge Type, Mezzanine (Board to Board) category. It is used for various applications and can integrate into a variety of mezzanine systems. This connector can be utilized for a wide variety of applications, with customized designs for multiple platforms.

The DF23C-14DS-0.5V(53) comes with a high pin count, small form factor, and a small profile, while still maintaining a high-speed performance. This can make it suitable for a variety of applications, from high-density/low-profile applications requiring more contact points to larger, multi-board mezzanine systems. The connector features a design that allows for good signal integrity and excellent vibration/shock performance, making it ideal for mission-critical applications.

The DF23C-14DS-0.5V(53) features an HIROSE compliant design, making it easy to integrate with existing systems. It provides a secure connection, with a wide range of thermal and mechanical oscillation performance, and is compatible with a variety of industry-standard mezzanine systems. This connector includes a variety of locking solutions, including tabs, retention clips, and rigid housings. It also comes with a 0.5mm pitch, allowing for a high-density configuration.

In addition to providing a secure connection, the DF23C-14DS-0.5V(53) is also designed to withstand extreme environmental conditions. It is rated for temperatures up to 105°C, and can withstand humidity up to 95%. It also provides excellent chemical resistance, making it ideal for various applications.

The DF23C-14DS-0.5V(53) is used for a wide variety of applications, including computer and networking equipment, industrial control systems, test and measurement devices, medical equipment, military equipment, and automotive applications. It can also be used for high-speed, cost-sensitive mezzanine systems, and other applications requiring a secure connection.

The DF23C-14DS-0.5V(53) is a reliable and versatile connector, designed for use in a variety of applications. It features a secure connection, a wide range of thermal and mechanical performance, and a low-profile design. This allows for easy integration into various mezzanine systems, making it suitable for high-performance, cost-sensitive applications.

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