DF30FB-80DP-0.4V(81)

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) features and uses a DF30FB-80DP-0.4V (81) configuration. This type of connection provides a safe and reliable solution for the user and their particular application. The DF30FB-80DP-0.4V (81) connects two PCBs together, providing excellent signal and power transfer with a robust design.

The DF30FB-80DP-0.4V (81) features an edge type connection with a 0.4mm pitch, and 80 pin array. The connection is made via a contactless soldering process and features a special insulation material which prevents any short circuits. The array has an uneven number of pins, so it is necessary to take this into account when designing the PCBs. This product is RoHS compliant and has a maximum current of 5 amps.

The MEZZANINE connector of the DF30FB-80DP-0.4V (81) is an ideal solution for applications for mobile devices requiring a high number of contacts in a dense design. The 0.4mm pitch is suitable for high-speed signal transmission and relatively small layouts. This results in a cost effective solution for the user, allowing them to save on board space and time.

The DF30FB-80DP-0.4V (81) connector’s working principle is simple yet robust. This connection operates with an insulation displacement technology, where the contacts of the socket slides onto the contacts of the board. This eliminates the need for soldering and ensures secure connection without any risk of short circuiting. The pins on the board itself are also bent outwards to prevent any undesirable wetting.

The DF30FB-80DP-0.4V (81) connection is suitable for many different applications, some of which are: medical equipment, automotive, industrial, consumer electronics and other general applications such as servers and telecoms. This connection is very reliable and resistant to harsh environments, making it suitable for implementations and applications with a wide range of factors to be considered.

This connector is a great option for various applications due to its robust and reliable design. Its insulation displacement technology eliminate the needs for soldering, making connections quick and simple, and it’s 80 pin array makes the connection highly reliable and suitable for many applications with a wide range of requirements. The MEZZANINE connection interface of this product makes it suitable for high speed signal transmission in even the most densely populated layouts, giving the user a cost effective solution that also saves on board space and time.

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