DF30FB-70DP-0.4V(82) Allicdata Electronics
Allicdata Part #:

DF30FB-70DP-0.4V(82)-ND

Manufacturer Part#:

DF30FB-70DP-0.4V(82)

Price: $ 0.79
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN HEADER 70POS 0.4MM SMD GOLD
More Detail: 70 Position Connector Header, Center Strip Contact...
DataSheet: DF30FB-70DP-0.4V(82) datasheetDF30FB-70DP-0.4V(82) Datasheet/PDF
Quantity: 1000
1000 +: $ 0.71820
Stock 1000Can Ship Immediately
$ 0.79
Specifications
Series: DF30
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header, Center Strip Contacts
Number of Positions: 70
Pitch: 0.016" (0.40mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Solder Retention
Contact Finish: Gold
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.9mm
Height Above Board: 0.035" (0.88mm)
Description

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The DF30FB-70DP-0.4V(82) is a rectangular connector that belongs to the Arrays, Edge Type, Mezzanine (Board to Board) category. It is mainly used as a board-to-board connector, incorporating conductive contacts and a housing made from stainless steel material. The connector allows for an easy and intuitive mating process, linking two boards to establish a signal pathway.

The main characteristic of the DF30FB-70DP-0.4V(82) is its reduced height. The 0.4V or 0.2V version are designed to fit in constrained environments. This allows for better space management, while still offering the capacity for increased circuitry. The low profile option makes the DF30FB-70DP-0.4V(82) suitable for embedded applications, with minimal height requirements.

The DF30FB-70DP-0.4V(82) comes with a 70mm spacing between each of the contacts. This provides a wide port area for a larger number of signal pathways. The EMI shielding material incorporated is designed to reduce the amount of noise and interference. The 0.4 mm spacing ensures that the board-to-board mating process is secure and reliable.

The DF30FB-70DP-0.4V(82) is mainly designed for mobile and field-related applications. Its reduced profile allows for easy, yet secure installation. This eliminates the need for pre-crimping, thus lowering costs and setup time. This makes it suitable for applications that involve multiple board mating processes.

The DF30FB-70DP-0.4V(82) is designed with three principles in mind: durability, reliability, and versatility. The stainless steel housing and the rugged construction of the DF30FB-70DP-0.4V(82) allow for increased durability and resistance against harsh conditions. The ruggedness makes it suitable for field applications, while the reliable connection guarantees signal integrity. The wide range of port areas available further guarantees versatility and allows for a wide array of applications.

In conclusion, the DF30FB-70DP-0.4V(82) is a rectangular connector that belongs to the Arrays, Edge Type, Mezzanine (Board to Board) category. It is designed to provide a secure and reliable connection between two boards without pre-crimping. Its reduced height and wide port area, as well as its stainless steel housing, make it suitable for mobile and field applications. The DF30FB-70DP-0.4V(82) is further characterized by its durability, reliability, and versatility, due to the rugged construction and reliable connection.

The specific data is subject to PDF, and the above content is for reference

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