DF37B-20DP-0.4V(53) Connectors, Interconnects

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The DF37B-20DP-0.4V(53) is an array, edge type, mezzanine (board to board) type connector manufactured with superior quality materials. It is designed for ultra-high density array packaging with 0.4mm minimum contact pitch, double-row, 0.4 DAC solvable contacts, and contacts with gold plated surface lead-free solderable connections. Moreover, the DF37B-20DP-0.4V also provides a perfectly aligned multi-hull construction and a host of integral features including IDC contacts, a solder tail design, and internal locking system assembly.

The DF37B-20DP-0.4V(53) is mainly used in products with a wide range of applications including Electronically Commutated Motors (ECMs), chip sets, storage system controllers, smart phones, consumer electronics products, motherboards, graphics cards, and so on. In addition, it can also be used in applications such as automotive, telecommunication, networking, lighting, server, home entertainment, and industrial control.

In terms of its working principle, the DF37B-20DP-0.4V(53) consists of two signal and power paths, a power contact, and a ground contact. The power contact provides power for the product and the ground contact provides a path to ground. The two signal and power paths, the power contact, and the ground contact are all designed with superior quality materials and feature gold-plated surface lead-free solderable connections. Moreover, the DF37B-20DP-0.4V(53) also features a unique board-to-board locking mechanism which provides secure and reliable interconnection.

The DF37B-20DP-0.4V(53) is a top-of-the-line array, edge type, mezzanine (board to board)type connector. It boasts a wide range of features and applications, making it an ideal choice for high-density array packaging. Its superior quality materials, gold-plated surface lead-free solderable connections, and unique board-to-board locking mechanism make it a reliable and secure choice for a variety of applications.

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