DF9B-31P-1V(32)

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The DF9B-31P-1V(32) is an array, edge type, mezzanine rectangular connector designed for board-to-board connections. This connector is part of the Hirose Electric Company product line-up. It features 32 contacts in a 2mm pitch double row configuration, with a mounting size of 13.3 x 9.1mm. A maximum of 200VAC is rated for the mating connectors. The body of the connector is nylon, and it is available in black and version with ceramic spacers. The DF9B-31P-1V(32) has a current rating of 1A per contact, and an insulation resistance value of 500 MΩ min.

The DF9B-31P-1V(32) is designed for use in industrial and broadcast applications, and is particularly suited for providing reliable connections between two circuit boards. It is suited for applications such as industrial fieldbus, Ethernet, USB, Audio, Amplifiers, Video signal path, Hard disk, Telecommunication, Motor controls and automation, and Medical equipment.

The main working principle behind the DF9B-31P-1V(32) connector is the transfer of both data and power between two flat surfaces. It is a friction-fit mezzanine connector designed to plug into two flat surfaces without the need for any additional hardware. The connector is held in place with two screws, which provide mechanical retention of the connection. The impedance is tightly controlled, typically at a range of 100-300 ohms, with lower resistances in the milliohm region for higher speed data transfer. The contact area of the connector is designed to prevent any corrosion of the connection.

The DF9B-31P-1V(32) has a wide operating temperature range of -40°C to 85°C, and it is designed to be compliant with IEC 60950, EN 400000, and UL94-VO specifications. This connector is also RoHS compliant.

In conclusion, the DF9B-31P-1V(32) is a reliable, cost-effective connector solution for board-to-board applications. It features a low signal loss of 0.2 dB per connection, and is designed for a wide range of temperatures. With its excellent impedance control, it is a great choice for high speed data transfer between surfaces, and its low profile make it ideal for space constrained applications.

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