| Allicdata Part #: | 603-1749-ND |
| Manufacturer Part#: |
DHS-B9090-11A |
| Price: | $ 21.74 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Delta Electronics |
| Short Description: | HEATSINK ASSY INTEL NEHALEM 1366 |
| More Detail: | Heat Sink LGA Aluminum Board Level |
| DataSheet: |  DHS-B9090-11A Datasheet/PDF |
| Quantity: | 70 |
| 1 +: | $ 19.76310 |
| 10 +: | $ 18.59760 |
| 25 +: | $ 17.43540 |
| 50 +: | $ 16.27290 |
| 100 +: | $ 15.69170 |
| 250 +: | $ 14.82000 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | LGA |
| Attachment Method: | Bolt On |
| Shape: | Square, Fins |
| Length: | 3.543" (90.00mm) |
| Width: | 3.543" (90.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.004" (25.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 0.26°C/W |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | -- |
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A thermal-heat sink is an electronic component used to dissipate heat generated from circuit boards and other electrical components. Thermal-heat sinks are highly effective in increasing the efficiency of electronic systems by preventing the components from overheating and potentially damaging them.
The DHS-B9090-11A thermal-heat sink is a thermal-management component designed for high-performance electronic systems, servers and storage, and gaming consoles. The DHS-B9090-11A is a highly efficient heat sink that combines excellent thermal performance and compact design with an innovative pin-fin array. It is designed for ultra-low thermal resistance, allowing for high power densities and maximum heat dissipation.
The DHS-B9090-11A thermal-heat sink is designed to dissipate up to175 Watts of power from enthusiast systems, including gaming consoles, servers and storage, and other systems requiring powerful thermal-management solutions. The heat-sink features a 160mm x 160mm base, and a mounting height of 48mm. The DHS-B9090-11A utilizes a patented pin-fin array to deliver exceptionally low thermal resistance. The pin-fin array also reduces air turbulence and maximizes heat dissipation area for better cooling performance.
The DHS-B9090-11A is designed for direct contact with CPU core, making it suitable for high-powered CPUs and GPUs as well as other high-powered components. The DHS-B9090-11A features three-dimensional fin arrays that provide superior cooling performance and efficient air flow. The heat-sink also features a snap-in fan mounting system, making installation quick and easy. The snap-in design also securely attaches the fan to the heat-sink to prevent vibration.
The DHS-B9090-11A provides an innovative way to dissipate heat and reduce temperatures to extend component life and enhance the performance of high-powered electronic systems. It features a unique pin-fin array that provides higher levels of thermal performance than traditional heat sinks, allowing for higher power densities and more efficient cooling solutions. The DHS-B9090-11A also features a snap-in fan mounting system for quick and easy installation and a three-dimensional fin array for improved air-flow and cooling performance.
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