DHS-B9292-05A Allicdata Electronics
Allicdata Part #:

603-1748-ND

Manufacturer Part#:

DHS-B9292-05A

Price: $ 28.63
Product Category:

Fans, Thermal Management

Manufacturer: Delta Electronics
Short Description: HEATSINK ASSY INTEL LGA2011
More Detail: Heat Sink LGA Aluminum Board Level
DataSheet: DHS-B9292-05A datasheetDHS-B9292-05A Datasheet/PDF
Quantity: 26
1 +: $ 26.02530
10 +: $ 24.49440
25 +: $ 22.96350
50 +: $ 21.43260
100 +: $ 20.66720
250 +: $ 19.51900
Stock 26Can Ship Immediately
$ 28.63
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: LGA
Attachment Method: Bolt On
Shape: Square, Fins
Length: 3.602" (91.50mm)
Width: 3.602" (91.50mm)
Diameter: --
Height Off Base (Height of Fin): 2.519" (64.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.17°C/W
Material: Aluminum
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions like the DHS-B9292-05A are becoming more pervasive in applications where heat dissipation is required. Heat sinks are used to aid thermally-challenged components, such as processors, chipsets and other integrated circuits (ICs), to dissipate heat by providing increased surface area. More specifically, the DHS-B9292-05A is a tube-fin-formed aluminum heat sink that is suitable for big power applications.

The primary advantage of using a DHS-B9292-05A is its form-factor. It is slim enough (75 x 50 mm) to fit inside most commercial-grade enclosure boxes while still providing substantial surface area for dissipating heat. Additionally, its vertical slits enable air to pass through it, further aiding its heat?dissipation capabilities. The DHS-B9292-05A comes with predrilled holes, allowing easy mounting and installation.

Heat dissipation is a very important consideration in electronics systems engineering. Heat sinks are used to provide additional surface area for heat dissipation from the internal components. Heat sinks are designed to absorb thermal energy from components and dissipate it into the surrounding environment. Heat sinks are essential for ensuring optimal performance of the system, as heat buildup can cause components to overheat, leading to failure or decreased performance.

The DHS-B9292-05A is designed and manufactured to ensure high reliability and long life, providing excellent performance during extended periods of use. The unit is designed with high-grade aluminum extrusion for better corrosion resistance and optimal heat dissipation. It is designed with two perforation techniques – “perforations-in” and “offset holes” – to optimize surface area for heat dissipation.

The working principle of the DHS-B9292-05A is based on the fact that heat is dissipated from components, such as ICs, to the surrounding environment due to convection, radiation and conduction. When integrated in an electronics system, the heat sink absorbs thermal energy from the component it is attached to and dissipates it into the atmosphere. Heat accumulation and dissipation are conditioned by the laws of thermodynamics, namely the second law of thermodynamics.

The DHS-B9292-05A design has proven to be a reliable part for thermal management applications for many types of electronics, including communications, automotive, military, medical, and industrial. Its unique slotted design along with its direct-contact heat dissipation make it well-suited to commercial, professional, industrial, and military applications. High heat flux components such as high power processors, also benefit from its low-profile design.

In summary, the DHS-B9292-05A is a tube-fin-formed aluminum heat sink that is suitable for big power applications. It is designed to provide substantial surface area while fitting into commercial-grade enclosures. With its optimized surface area and two perforation techniques, the thermal performance has proven to be reliable for many types of electronics applications, including military, automotive, medical, industrial, and communications.

The specific data is subject to PDF, and the above content is for reference

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