DIP632-001BLF Allicdata Electronics
Allicdata Part #:

DIP632-001BLF-ND

Manufacturer Part#:

DIP632-001BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN IC DIP SOCKET 32POS GOLD
More Detail: N/A
DataSheet: DIP632-001BLF datasheetDIP632-001BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tube 
Part Status: Obsolete
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: --
Termination Post Length: 0.125" (3.18mm)
Material Flammability Rating: UL94 V-0
Contact Resistance: --
Description

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Sockets for ICs, Transistors, and other electrical components are vital tools for creating and maintaining complex electronics and products. Popular applications include those for circuit boards, control and data acquisition, and measuring equipment. One of the most commonly used and popular sockets is the DIP632-001BLF socket, which is commonly used in printed circuit boards, amplifiers, signal processing units, and test and measurement equipment. In this article, we\'ll explore the application field and working principles of this type of socket.

Application Field

The DIP632-001BLF socket is a dual-in-line (DIP) socket made of an epoxy filled header body and two side-mounted contact arms. It is designed to fit industry standard .3" wide DIP packages with 0.300" (7.6 mm) centerline spacing. This socket is designed to be used in printed circuit boards (PCBs), amplifiers, signal processing units, and test and measurement equipment. It is commonly used to make electrical connections between two or more components.

Due to its small size, the DIP632-001BLF socket is great for revamping existing circuitry on a PCB or connecting smaller components or chips. Its small size allows it to be used securely in high frequency and high density applications, making it perfect for use in a variety of industries such as medical, aerospace, and automotive.

Working Principle

The DIP632-001BLF socket is connected to a printed circuit board through the use of soldering. The socket has two contact arms on either side of the header body, and these contact arms connect to the components that need to be electrically connected to the board. The contact arms have contact pins which allow electrical signals to pass through them from one device to another.

Once the components are connected to the pc board and the socket is soldered on, the signals can be transmitted from one device to the other. The number of pins that the socket can accommodate is dictated by the size of the contacts. Some smaller contacts can only accommodate up to eight pins, whereas larger contacts can hold up to 28 pins.

The working principle of a DIP socket is simple and effective. By placing the socket between two components, the user is able to create a secure connection that will facilitate the transfer of electrical signals from one component to another. This type of socket is a reliable and convenient way to transfer signals between different components on a circuit board.

The DIP632-001BLF socket is a versatile and dependable solution to many electronic connection needs. It is small, easy to install, and can be used in applications with a variety of different electrical components. With its reliable and secure connection, it is one of the most popular choices for circuit boards, amplifiers, signal processing units, and other test and measurement equipment.

The specific data is subject to PDF, and the above content is for reference

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