Allicdata Part #: | DS3151+-ND |
Manufacturer Part#: |
DS3151+ |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Maxim Integrated |
Short Description: | IC LIU DS3/E3/STS-1 SGL 144CSBGA |
More Detail: | Telecom IC Line Interface Unit (LIU) 144-TECSBGA (... |
DataSheet: | DS3151+ Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Packaging: | Tray |
Part Status: | Obsolete |
Function: | Line Interface Unit (LIU) |
Interface: | LIU |
Number of Circuits: | 1 |
Voltage - Supply: | 3.135 V ~ 3.465 V |
Current - Supply: | 75mA |
Operating Temperature: | 0°C ~ 70°C |
Mounting Type: | Surface Mount |
Package / Case: | 144-BGA, CSPBGA |
Supplier Device Package: | 144-TECSBGA (13x13) |
Includes: | -- |
Base Part Number: | DS3151 |
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DS3151+ Application Field and Working Principle
The DS3151+ is a predecessor of the popular DS3153 chipset which has a good place in the network interface card (NIC) market. With the newer LDPC code, the DS3151+ offers a greater level of stability, reliability and speed than the traditional BPDM model.
Application field
The DS3 151+ is suitable for 10Gbps long-distance communication through SONET/SDH line interface cards, single-mode fiber link cards, and third-party products such as Gigabit Ethernet, Serial RapidIO or Infiniband. In addition, it is also quite suitable for gigabit Ethernet applications that use the emerging 10GBASE-T and 10GBASE-CX4 standards. For moderate-distance traffic such as datacenter transmission, the DS3 151+ is suitable for adoption.
Working Principle
The data link layer of the DS3151+ is required to guarantee the transmission of data in an network environment. Effectively, it serves as an arbitrator between the physical layer and the communication interface protocols that the nodes use to communicate with each other. In this role, the link layer not only ensures that the data has been successfully received by the physical interfaces, but also makes sure that it is properly handled by the protocol layer as well.
The method of data transmission is varied, and depends on the particular protocol being used at the time. By way of example, Ethernet can send frames over a network using half-duplex or full-duplex. In the case of half-duplex, data is sent in one direction, while in full duplex, data is sent in both directions. The link layer determines which of the two formats will be used. It additionally performs functions such as physical addressing and error handling.
The physical layer of the DS3151+ is responsible for data encoding, transmission, and reception. This includes the sending and receiving of signals through the actual media, such as wired networks or fiber optics lines. The physical layer also ensures that signals are properly modulated, and that data is successfully extracted from the incoming signals.
In conclusion, the DS3151+ combines the features of both the data link layer and the physical layer, allowing it to perform both functions with a high level of reliability, quality of service and speed.
The specific data is subject to PDF, and the above content is for reference
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