DV-T263-101E

Series:	D
Part Status:	Discontinued at Digi-Key
Type:	Top Mount
Package Cooled:	TO-263 (D²Pak)
Attachment Method:	Solderable Feet
Shape:	Rectangular, Fins
Length:	0.500" (12.70mm)
Width:	1.020" (25.91mm)
Diameter:	--
Height Off Base (Height of Fin):	0.400" (10.16mm)
Power Dissipation @ Temperature Rise:	2.0W @ 30°C
Thermal Resistance @ Forced Air Flow:	8.00°C/W @ 500 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Degreased

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Thermal – Heat Sinks

Thermal – Heat Sinks are an integral part of many electronic components and are used to effectively transfer heat from the component to the outside air. As such, heat sinks are used to prevent over-heating and thus damage to sensitive electronic components. The DV-T263-101E is an example of a thermal – heat sink that is designed to provide an effective transfer solution for a variety of applications.

DV-T263-101E Features

The DV-T263-101E is a high quality, die-cast aluminum heat sink that is designed to dissipate heat efficiently and effectively. With its superior design and manufacturing quality, the DV-T263-101E offers low thermal resistance and high reliability. It has a unique finned design which allows for a larger convective heat transfer area that can increase the surface area by up to 400%. This additional surface area allows for better heat dissipation and increased overall performance. The DV-T263-101E also includes an integral air insulation layer which effectively restricts the air from coming into direct contact with the heat sink body. This helps to reduce the overall heat transfer rate and improve efficiency. Finally, the DV-T263-101E is designed with an FCC-compliant, self-extinguishing plastic housing for greater safety and durability.

DV-T263-101E Applications

The DV-T263-101E is designed for a wide range of applications and is suitable for use with a variety of electronic components. It is a great choice for thermal management in consumer electronics, automotive, telecommunications, data storage, office equipment, medical devices, and power electronics. As it offers improved heat transfer capabilities, it is ideal for applications that require a more efficient heat transfer solution.

DV-T263-101E Working Principle

The DV-T263-101E works to effectively transfer heat away from the component and dissipate it into the air. It works by using its finned design which features multiple fins that create air pathways near their surfaces. These pathways allow heat to be transferred away from the component and into the air. The heat is then transferred away from the component to the outside air by convection. The air-insulation layer in the DV-T263-101E also helps increase efficiency by stopping the air from coming into direct contact with the heat sink and reducing the overall rate of heat transfer.

Conclusion

The DV-T263-101E is an excellent example of an efficient thermal – heat sink. With its high-quality design and superior manufacturing, it offers low thermal resistance and increased performance. Its finned design and air-insulation layer allow for improved heat transfer capabilities and increased safety and durability. The DV-T263-101E is suitable for a variety of applications, making it an ideal choice for anyone who needs a reliable and efficient thermal management solution.

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