DV-T263-201E-TR Fans, Thermal Management |
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| Allicdata Part #: | DV-T263-201ETR-ND |
| Manufacturer Part#: |
DV-T263-201E-TR |
| Price: | $ 0.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | HEATSINK FOR TO-263 |
| More Detail: | Heat Sink TO-263 (D²Pak) Aluminum 2.0W @ 30°C Top ... |
| DataSheet: |  DV-T263-201E-TR Datasheet/PDF |
| Quantity: | 1000 |
| 200 +: | $ 0.89964 |
| 400 +: | $ 0.84672 |
| 600 +: | $ 0.79380 |
| 1000 +: | $ 0.74088 |
| 5000 +: | $ 0.71442 |
| Series: | D |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-263 (D²Pak) |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.020" (25.91mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.480" (12.19mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 30°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Degreased |
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Thermal - Heat Sinks play an essential role in regulating temperature fluctuations and reducing internal temperatures in electronic components. The DV-T263-201E-TR is an example of such a device. This heat-sink type is designed to effectively dissipate the heat generated by semiconductor packages and other electronic components, allowing for safe and reliable operation of the device throughout its lifetime.
Application Field and Working Principle of DV-T263-201E-TR
The DV-T263-201E-TR belongs to a family of thermal heat sinks, which are designed for providing an effective heat dissipation solution for electronic circuit and computer components. The DV-T263-201E-TR features an aluminum alloy construction, which offers durable thermal conductivity and superior corrosion resistance.
The DV-T263-201E-TR works on the basis of heat conduction, wherein it absorbs the excessive heat generated from the components, and transfers it away from the area, in order to keep the components running smoothly. The aluminum alloy used in this heat sink is an ideal thermal conductor, which offers excellent heat dissipation from the components to the atmosphere.
The main purpose of this type of heat sink is to protect sensitive components from overheating, giving them a longer life span. The efficient heat transfer provided by the DV-T263-201E-TR enables the components to function properly in extended exposure to high temperatures. This also helps in maintaining dependable and consistent power delivery to the components.
The designed aluminum alloy fins* of the DV-T263-201E-TR are formed to maximize the contact surface area up to the highest, thus allowing for maximum heat dissipation. This is done by the incorporation of heatpipes* around the heat sink, which carry the heat away from the device faster.
Benefits of DV-T263-201E-TR Thermal Heat Sinks
Using the DV-T263-201E-TR heat sink in electronic components offers various advantages including:
- Holds the components at a consistent temperature which improves the reliability of the device.
- Enables the operation of multiple components at different temperatures without thermal runaway.
- Provides a longer lifespan to the components due to minimized thermal stress.
- Provides greater flexibility in designing electronics products.
- Can be used in a variety of temperature environments.
- Uses a low-noise fan and provides for quiet operation.
*Heatpipe and aluminum alloy fins are not included in the DV-T263-201E-TR package.
Conclusion
The DV-T263-201E-TR is one of many types of thermal heat sinks available in the market today. It is a reliable and efficient heat dissipation solution for electronic components. This type of heat sink is an ideal choice for any application that requires a long-lasting and reliable performance.
The specific data is subject to PDF, and the above content is for reference