DV-T263-401E-TR

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of electronic components is becoming increasingly important as they tend to generate more and more heat as engineers push for greater performance. One of the most important methods of managing this heat is the use of heat sinks. They act as effective Heat Sinks by providing a large surface area for heat to dissipate, and come in a variety of shapes and sizes to suit the application needs.

The DV-T263-401E-TR is a high quality rectangular-shaped extruded aluminum heat sink that is designed for light to heavy thermal loads. It is made from round extruded aluminum material with a black anodized finish. The heat sink is designed to fit a wide range of applications, providing excellent thermal performance. It also features a low profile design, making it ideal for applications where height is a concern.

The DV-T263-401E-TR features a unique bonded “Fin” design which helps maximize the heat sink’s surface area. The heat sink’s top surface is equipped with a textured fin which helps to increase the air flow around the heat sink and helps distribute heat dissipation more evenly. In addition to the fin design, the heat sink also has an integrated baseplate, allowing for greater mechanical strength and stability.

The DV-T263-401E-TR can be used in a variety of electronic devices such as computers, servers, power supplies, and other small electronic components. It is most commonly applied to devices that require a low profile design and a high degree of thermal performance. It is also commonly used in applications where there are tight space constraints, as the low profile design allows it to fit into tight spots.

The working principle of the DV-T263-401E-TR is based on convection. By providing a large surface area for the heat to be drawn away from the component, the DV-T263-401E-TR is able to increase the convection process and improve the overall cooling performance. Convection is a natural process of air movement that occurs when hot air rises and cool air is drawn in to replace it. As the hot air rises, it takes the heat away from the component and dissipates it through the large surface area provided by the heat sink.

The DV-T263-401E-TR is an ideal thermal management solution for high performance electronic devices and components. Its light weight and low profile design make it easy to install, while its thermal efficiency and large surface area provide a great amount of cooling performance. With its ability to dissipate heat effectively, this heat sink can provide reliable thermal performance in a variety of applications.

The specific data is subject to PDF, and the above content is for reference