| Allicdata Part #: | DV-T268-301E-ND |
| Manufacturer Part#: |
DV-T268-301E |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | TO-268 SMD HEAT SINK |
| More Detail: | Heat Sink TO-268 (D³Pak) Aluminum 7.0W @ 35°C Top ... |
| DataSheet: |  DV-T268-301E Datasheet/PDF |
| Quantity: | 1000 |
| 0 +: | $ 0.00000 |
| Series: | D |
| Part Status: | Discontinued at Digi-Key |
| Type: | Top Mount |
| Package Cooled: | TO-268 (D³Pak) |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.580" (40.13mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.460" (11.68mm) |
| Power Dissipation @ Temperature Rise: | 7.0W @ 35°C |
| Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 700 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Degreased |
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Thermal management is an important part of any product development, which is why Heat Sinks are so essential. The DV-T268-301E device is an innovative thermal management solution, and it\'s used for a variety of applications in a variety of industries. The DV-T268-301E Heat Sink is designed to provide a wide range of efficient cooling solutions, demonstrating its versatility and reliability.
The Heat Sink is composed of a Fin Material, a Heat Transfer Area, and a Base Substrate. The Fin Material is a lightweight, high-performance material, designed to dissipate a large amount of heat. The Heat Transfer Area is designed to facilitate the transfer of heat away from the device, while the Base Substrate provides the structural strength and support. The combination of these materials results in a highly efficient, low-weight, and reliable cooling solution.
The working principle of this device is based on the thermoelectric effect. This is a process in which heat is transferred from one substance to another when electrical current is passed through them. This process is widely used in applications where thermal dissipation is important, such as electronics and computers. In the case of the DV-T268-301E Heat Sink, electrical current is passed through a Fin, creating a vacuum between the two substances. This causes the heat to be absorbed by the fins and transferred away from the device, resulting in improved thermal management.
The DV-T268-301E can be used in a range of applications including computers, servers, storage devices, automotive electronics, robotics, telecommunications, industrial equipment, and medical devices. Its wide-range of efficient cooling solutions, combined with its lightweight and reliable construction, makes it an ideal choice for thermal management.
The performance of the device can be further enhanced with the use of active cooling methods, such as a fan or forced convection. The fan provides an additional cooling capability that helps to dissipate the heat more quickly, resulting in improved efficiency. The forced convection will also create a larger surface area to dissipate the heat from the heat sink.
The DV-T268-301E is an innovative thermal management solution, designed to provide efficient cooling solutions for a wide range of applications. Its lightweight construction and reliable performance makes it an ideal choice for thermal management. The device can be further enhanced with active cooling methods for even better performance.
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