E2A-T220-25E Allicdata Electronics
Allicdata Part #:

E2A-T220-25E-ND

Manufacturer Part#:

E2A-T220-25E

Price: $ 0.97
Product Category:

Fans, Thermal Management

Manufacturer: Ohmite
Short Description: BLACK ANODIZED HEATSINK
More Detail: Heat Sink TO-220 Aluminum 2.0W @ 40°C Board Level,...
DataSheet: E2A-T220-25E datasheetE2A-T220-25E Datasheet/PDF
Quantity: 157
1 +: $ 0.88200
10 +: $ 0.83790
25 +: $ 0.81598
50 +: $ 0.79380
100 +: $ 0.74970
250 +: $ 0.70560
500 +: $ 0.66150
1000 +: $ 0.61740
5000 +: $ 0.59535
Stock 157Can Ship Immediately
$ 0.97
Specifications
Series: EX
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Shape: Rectangular, Fins
Length: 0.641" (16.28mm)
Width: 0.642" (16.30mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 16.40°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The E2A-T220-25E is a thermal heat sink product that is designed to provide superior cooling performance in applications where space limitations are a major consideration. The E2A-T220-25E is ideal for applications in computing, telecommunications, industrial control, and medical systems that require reliable cooling. The E2A-T220-25E is designed with a large thermal mass to ensure higher thermal efficiency and heat dissipation.

Application Field

The E2A-T220-25E is designed for applications in computing, telecommunications, industrial control and medical systems. It is especially suitable for applications that require reliable cooling and space-constrained environments. The E2A-T220-25E can be used to cool a variety of components, from power supplies and CPUs to memory and graphics cards.

The E2A-T220-25E has an efficient and compact design that can be used in desktop PCs, computer servers, servers, data centers, and telecom equipment. It is also well suited for cooling high-performance gaming machines and multimedia PCs. Furthermore, the E2A-T220-25E can be used in many other industrial and medical applications where reliable cooling is required.

Working principle

The E2A-T220-25E utilizes a high-grade aluminum fin, which dissipates heat through thermal radiation and convection. The aluminum fin has a large surface area which increases air contact. This enables more efficient heat transfer compared to traditional heat sinks. Additionally, the fins are designed with an optimized air-flow channel which increases air circulation around the fins and further reduces the operating temperature. This helps to reduce power consumption and noise levels.

The E2A-T220-25E has a fanless design, which eliminates the need for a separate cooling fan. This reduces power consumption, and noise levels, whilst providing a more reliable form of cooling. Furthermore, the fanless design also means that the heat sink can be used in a wide range of environmental conditions, including extreme temperatures.

The E2A-T220-25E features an innovative heat sink mounting system, which allows the E2A-T220-25E to be quickly and easily mounted to your motherboard or other heat-generating components. This mounting system also ensures improved heat dissipation and avoids contact problems associated with traditional heat sinks. Additionally, the E2A-T220-25E features a low profile design, enabling it to be installed in tight spaces and further enhancing its cooling efficiency.

Conclusion

The E2A-T220-25E is a highly efficient thermal heat sink solution for applications where space is a major consideration. The large thermal mass, efficient and compact design, fanless design and simple mounting system all contribute to the excellent performance of the E2A-T220-25E. The result is improved cooling performance and reliability in environments where space-constrained cooling is required.

The specific data is subject to PDF, and the above content is for reference

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