| Allicdata Part #: | E3A-T220-25E-ND |
| Manufacturer Part#: |
E3A-T220-25E |
| Price: | $ 1.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | BLACK ANODIZED HEATSINK |
| More Detail: | Heat Sink Bridge Rectifiers Aluminum Board Level |
| DataSheet: |  E3A-T220-25E Datasheet/PDF |
| Quantity: | 429 |
| 1 +: | $ 0.94500 |
| 10 +: | $ 0.89775 |
| 25 +: | $ 0.87419 |
| 50 +: | $ 0.85050 |
| 100 +: | $ 0.80325 |
| 250 +: | $ 0.75600 |
| 500 +: | $ 0.70875 |
| 1000 +: | $ 0.66150 |
| 5000 +: | $ 0.63788 |
| Series: | EX |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | Bridge Rectifiers |
| Attachment Method: | Bolt On |
| Shape: | Square, Fins |
| Length: | 1.000" (25.40mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.000" (25.40mm) |
| Thermal Resistance @ Natural: | 12.40°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal or heat sinks are devices designed to efficiently dissipate the thermal energy generated by electronic components. Thermal design is an important part of any thermal management system, and the E3A-T220-25E heat sink is a versatile and effective option for a range of applications. This article will outline the application field and working principle of the E3A-T220-25E, and discuss why this is an ideal thermal management solution.
Design and Specifications
The E3A-T220-25E is a top-mounted aluminum heat sink that has been designed to meet the demands of a range of applications. It has a total size of 99.3mm x 99.3mm x 22mm and a weight of only 69g. The aluminum material used in the construction has a high thermal conductivity of 230 W/m•K, and the device has been constructed to ensure low thermal resistance with minimal airflow. The device comes pre-fitted with twelve 0.75mm mating pins, making it easy to install into a range of devices. The pins have a high tensile strength, and the device is rigorously tested to ensure a long life.
Application Field
The E3A-T220-25E is suitable for a range of electronic applications, including industrial computing, consumer electronics, medical devices, and automotive systems. It is a particularly good choice for applications that require a low profile and high performance. The device can be used to dissipate thermal energy from processor chipsets, motor drivers, high power LEDs, and other high power components. It is particularly well-suited for use in mobile devices, due to its light weight and small size.
Working Principle
The working principle of the E3A-T220-25E is simple and effective. It utilizes thermal conduction to transfer the thermal energy generated by the electronic components away from the device. This is done by converting the heat into a radiative form. The aluminum material is highly conductive, and as the temperature of the device increases, the material becomes more prone to radiating the thermal energy. This process continues until the thermal energy is completely dissipated into the surrounding environment, ensuring the device remains cool and in optimal working condition.
Benefits
The E3A-T220-25E offers a number of advantages over other thermal management solutions. It is lightweight and compact, making it easy to install in a range of devices. It has a high thermal conductivity, which ensures the thermal energy is efficiently dissipated. It also has a low profile, which helps maximize the available space within a device. Finally, the device is rigorously tested to ensure long life and reliable operation.
Conclusion
The E3A-T220-25E is an excellent option for a range of thermal management applications. It is lightweight, compact, and highly effective. It is also easy to install and requires minimal airflow for efficient operation. The device is rigorously tested to ensure a long life and reliable operation, making it an ideal thermal management solution for a variety of electronic applications.
The specific data is subject to PDF, and the above content is for reference