
Allicdata Part #: | EA-T220-38E-ND |
Manufacturer Part#: |
EA-T220-38E |
Price: | $ 1.57 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | HEATSINK FOR TO-220 BLACK |
More Detail: | Heat Sink TO-220 Aluminum 8.0W @ 80°C Board Level,... |
DataSheet: | ![]() |
Quantity: | 149 |
1 +: | $ 1.42380 |
10 +: | $ 1.38726 |
25 +: | $ 1.34946 |
50 +: | $ 1.27449 |
100 +: | $ 1.19952 |
250 +: | $ 1.12455 |
500 +: | $ 1.08706 |
1000 +: | $ 0.97461 |
5000 +: | $ 0.95587 |
Series: | E |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.500" (38.10mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 8.0W @ 80°C |
Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 300 LFM |
Thermal Resistance @ Natural: | 10.40°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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.Thermal - Heat Sinks
A Heat sink is a thermal device used to cool integrated circuits and other electronics. It is designed to dissipate heat generated in electronic components and maintain temperature levels that are conducive to proper operation. Heat sinks are commonly used for cooling computers, air conditioners, and certain amplifiers, among other things. EA-T220-38E is one such heat sink designed to provide optimal thermal conductivity and resistance to air flow, which is necessary in order to provide proper heat dissipation.
EA-T220-38E application field
The EA-T220-38E heat sink is designed to work interchangeably with a variety of semiconductor components, including MOSFETs, bipolar transistors, and diodes. It is a relatively large heat sink, measuring 38 mm high and 220 mm wide, making it suitable for cooling faster-clocked processors or components that generate higher heat. The heat sink is black anodized, providing corrosion-resistant characteristics as well as an aesthetically pleasing look.
EA-T220-38E Working Principle
The EA-T220-38E heat sink operates on the principle of thermoelectric cooling. This type of cooling utilizes the principle of heat transfer and convection to dissipate heat away from the component being cooled. This is achieved by circulating a fluid, usually water, around the base of the heat sink. The fluid absorbs the heat generated by the component and carries it away from the component, thus cooling it.
The heat sink also utilizes a series of fins that allow more air to circulate around the component being cooled, thus enabling a more efficient cooling process. These fins have small hole openings which allow air to pass through, thus aiding in the cooling process. Additionally, the heat sink is designed with a copper base to provide an excellent thermal conductivity. This helps to ensure that the heat generated by the component is quickly and efficiently dissipated away from it. This ensures that the component is not subjected to excessive temperatures, which could potentially damage it.
In conclusion, the EA-T220-38E heat sink offers an ideal solution for cooling large and complex semiconductor components. It provides excellent thermal conductivity while remaining corrosion-resistant due to its black anodized surface. Additionally, its series of interlocking fins provide an even more effective cooling solution, allowing more air circulation to quickly and efficiently dissipate heat away from the component. Therefore, the EA-T220-38E heat sink is an ideal choice for cooling larger and faster-clocked components.
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