Allicdata Part #: | EDBM432B3PD-1D-F-D-ND |
Manufacturer Part#: |
EDBM432B3PD-1D-F-D |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC DRAM 12G PARALLEL 533MHZ |
More Detail: | SDRAM - Mobile LPDDR2 Memory IC 12Gb (384M x 32) P... |
DataSheet: | EDBM432B3PD-1D-F-D Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Packaging: | Tray |
Part Status: | Obsolete |
Memory Type: | Volatile |
Memory Format: | DRAM |
Technology: | SDRAM - Mobile LPDDR2 |
Memory Size: | 12Gb (384M x 32) |
Clock Frequency: | 533MHz |
Write Cycle Time - Word, Page: | -- |
Memory Interface: | Parallel |
Voltage - Supply: | 1.14 V ~ 1.95 V |
Operating Temperature: | -30°C ~ 85°C (TC) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
The EDBM432B3PD-1D-F-D is a type of memory, specifically a 3D stacked die memory module. It is used in a variety of applications, most notably in highly demanding and computational intensive environments. It is one of the most reliable and popular memory modules used today. This article will discuss the various application fields and working principle of the EDBM432B3PD-1D-F-D.
Application Fields
The EDBM432B3PD-1D-F-D is used in many different types of applications. Most notably, it is found in large-scale data centers. This type of memory is used in these environments due to its high performance and reliability. In addition, it is often used in artificial intelligence (AI) systems, as it can quickly process large amounts of data. It is also used in gaming and entertainment applications, as it can handle complex graphics and gaming tasks. Finally, it is often used in industrial applications, where it provides reliable and high-performance memory solutions.
Working Principle
The EDBM432B3PD-1D-F-D is a 3D stacked die memory module. It is composed of multiple memory dies stacked on top of each other. Each die has its own dedicated data bus, instruction path, and other elements. This allows for faster transfer of information between dies, significantly increasing the data processing speed. Additionally, the 3D stacking of the memory dies also increases its reliability, as the failure of one die does not affect the performance of the others. As a result, the EDBM432B3PD-1D-F-D is able to handle the most demanding workloads with a high level of reliability.
Conclusion
The EDBM432B3PD-1D-F-D is a highly reliable and popular type of memory module. It is used in a variety of applications, most notably in data centers, AI systems, gaming and entertainment applications, and industrial use cases. Its 3D stacking and dedicated data buses allow it to quickly process large amounts of data, while its high level of reliability make it the preferred choice in many demanding workloads. As a result, the EDBM432B3PD-1D-F-D is one of the go-to memory modules for many different types of applications.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
---|
EDBM432B3PB-1D-F-D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G PARALLEL 168F... |
EDBM432B3PD-1D-F-D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G PARALLEL 533M... |
EDBM432B3PF-1D-F-D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G PARALLEL 168F... |
EDBM432B3PB-1D-F-R TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G PARALLEL 168F... |
EDBM432B3PD-1D-F-R TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G PARALLEL 533M... |
EDBM432B3PF-1D-F-R TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G PARALLEL 168F... |
IC DRAM 32G 1866MHZ FBGASDRAM - Mobile L...
LPDDR3 6G DIE 192MX32Memory IC
IC DRAM 24G 1866MHZ FBGASDRAM - Mobile L...
IC SRAM 128K PARALLEL 84PLCCSRAM - Dual ...
IC SRAM 16K PARALLEL 52PLCCSRAM - Dual P...
IC SRAM 512K PARALLEL 100TQFPSRAM - Dual...