ELVM04900

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The ELVM04900 terminal block and wire to board connector is a product developed and manufactured by Molex. It provides a reliable, efficient and secure connection solution for all types of electrical applications in a range of industries, including automotive, computer, medical, industrial, and military, in a variety of environments.

The ELVM04900 features a standard 2.50 mm pitch, along with a simple snap-in assembly, making it ideal for both high-density and medium to low-density applications. It is available in shrouded or unshrouded configurations, with 2 to 16 pins, for a broad array of application needs. This reliable interconnect solution is UL 94V-0 compliant and meets most international safety requirements. It also features a current rating of 20A, a voltage rating of 600V, and a temperature rating of up to 105°C.

The ELMV04900 features a unique design that allows for minimal contact resistance and provides a secure mechanical connection. It utilizes a small pin-contact design, which helps to provide a reliable connection with low contact resistance and high contact reliability. The connector also features a spring retention system that makes installation and removal quick and easy.

The working principle of the ELVM04900 terminal block and wire to board connector is simple. When the connector is mated to the host PCB, the pin contact is pushed onto the terminal pin. This allows for a secure electrical and mechanical connection that is designed to last for the lifetime of the application. The spring retention system secures the connector to the PCB, allowing for quick and easy installation and removal.

Overall, the ELVM04900 terminal block and wire to board connector is a durable and reliable interconnect solution that offers a secure connection for a wide variety of electrical applications. It is UL 94V-0 compliant and can handle up to 20A currents. Its unique design provides minimal contact resistance, along with an easy to use snap-in assembly. It is ideal for high-density and medium to low-density applications, and can be used in a variety of industries in a variety of environments.

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