ERF8-013-07.0-L-DV-TR

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ERF8-013-07.0-L-DV-TR is a mezzanine connector which belongs to rectangular connectors arrays, edge type series. It has two boards; top board and bottom board assembled together by the interlocking parts. The top board features 7 squares which holds the 7 different contacts. The bottom board has an array of pins and the cables are soldered onto pins which shunt the contact between the two facing arrays of pins.

ERF8-013-07.0-L-DV-TR contact material consists of gold/tin plating steel with high operating temperature which increases the lifetime of the contact. It is a type of ribbon-style interconnect system that supports high-density, highly reliable connections. The strong, low profile design allows smaller board to board connectors to be used in different applications. Moreover, the internal contact mating design permits top mount mated parts stack and the integrative part of the connector increases the reliability and durability of the operation.

The application field of ERF8-013-07.0-L-DV-TR includes data communication, telecommunication, computer, automotive, consumer electronics, power supply, medical, instrumentation and control and many more. The connector can be used in a wide range of high power and signal applications. It is mainly used in highly reliable, intensive connections among boards and cables.

ERF8-013-07.0-L-DV-TR has several features that make it suitable for applications such as aerospace, medical, and transportation. Its reinforced insulation provides the connector with a higher voltage rating, EMC protection and reliability. In addition, it also has an anti-ESD protection which makes it ideal for protecting sensitive electronics from electrostatic discharge. The gold plating ensures a reliable electrical connection and contact. This also increases the contact resistance and provides protection against harsh weather conditions.

The working principle of ERF8-013-07.0-L-DV-TR is simple; it interlocks both the top and bottom boards and forms a ribbon connection. The top board holds the 7 contacts while the bottom board has an array of pins. The cables are soldered onto pins which transmit the contact between the two facing arrays of pins. When the boards are unlocked, the contact between the boards can be formed by adding additional spacers. This connection is usually made by soldering, but it can also be done mechanically.

To ensure reliable and consistent connection, ERF8-013-07.0-L-DV-TR also includes a locking mechanism which ensures accurate contact interface. The connector features a polarized header/socket pairing which allows for correct orientation and high precision. To further ensure high performance, this type of connector is constructed with anti-resonance structure, insulation materials, shock and vibration proof design.

In conclusion, ERF8-013-07.0-L-DV-TR is a type of mezzanine connector which is used in a wide range of high power and signal applications. It is suitable for applications such as aerospace, medical, and transportation. It has a reinforced insulation that provides the connector with a higher voltage rating, EMC protection and reliability. In addition, it has a locking mechanism which ensures accurate contact interface and a polarized header/socket pairing which allows for correct orientation and high precision. With its strong, low profile design, it allows for smaller board to board connectors to be used in different applications, further increasing its reliability and durability.

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