ERM5-040-04.0-L-DV-K-TR

Series:	Edge Rate™ ERM5
Packaging:	Tape & Reel (TR)
Part Status:	Active
Connector Type:	Header, Outer Shroud Contacts
Number of Positions:	80
Pitch:	0.020" (0.50mm)
Number of Rows:	2
Mounting Type:	Surface Mount
Features:	Board Guide, Pick and Place
Contact Finish:	Gold
Contact Finish Thickness:	10.0µin (0.25µm)
Mated Stacking Heights:	9mm, 11mm
Height Above Board:	0.270" (6.85mm)

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An ERM5-040-04.0-L-DV-K-TR rectangular array of connectors utilizes numerous soldering points and a mezzanine board-to-board interconnection for improved signal integrity and enhanced durability in challenging industrial applications.

Mezzanine connectors are an ideal connection solution for two-dimensional circuit boards that require complex interconnections between multiple layers and multiple boards. This type of array connector consists of two separate halves, an upper and a lower, that mate to form a single electrical and mechanical connection. The ERM5-040-04.0-L-DV-K-TR array utilizes a combination of soldering points and press fit pins that provide superior electrical conduction and reliability.

In terms of application field, the ERM5-040-04.0-L-DV-K-TR array is best utilized in data storage and communication systems, as well as heat-sensitive applications where soldering temperatures could potentially damage other components. The array is also suitable for medical instruments, process control equipment, test and measurement systems, and industrial automation.

When it comes to the working principles, the ERM5-040-04.0-L-DV-K-TR array is designed to be a high-performing, secure connection solution. Keeping with this end in mind, the array utilizes a mezzanine board-to-board connection that provides reliable transmission of electrical signals. Through this connection, all electrical signals are kept in place, preventing the possibility of data leakage or miscommunication.

To ensure the utmost signal integrity in these mezzanine board-to-board connections, the ERM5-040-04.0-L-DV-K-TR relies on press fit pins that are held securely in place by soldering points. In addition, the array also utilizes a temperature rating of -30 to +172 C for enhanced durability. Finally, the array is also designed to maintain a consistent noise-free connection, whatever the size of the board-to-board array.

In conclusion, the ERM5-040-04.0-L-DV-K-TR array is an ideal choice for applications that require reliable, secure interconnections. The mezzanine board-to-board connection, combined with soldering points to keep the press fit pins in place, enable the array to deliver superior signal integrity and reliable data transmission. The array is also temperature rated up to an impressive -30 to +172 C, which makes it a great choice for heat-sensitive applications.

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