Allicdata Part #: | ET1.2-68-F1A-ND |
Manufacturer Part#: |
ET1.2-68-F1A |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Laird Technologies - Engineered Thermal Solutions |
Short Description: | THERMOELECT |
More Detail: | Peltier Module |
DataSheet: | ET1.2-68-F1A Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Outline L x W x H: | -- |
Qmax @ Th: | -- |
Delta Tmax @ Th: | -- |
Operating Temperature: | -- |
Features: | -- |
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Thermoelectric modules consist of two separate parts, one absorbing heat and the other releasing it. They are also known as Peltier modules. The ET1.2-68-F1A thermoelectric module is suitable for applications requiring high heat flow control and stable operation with good power efficiency.
The ET1.2-68-F1A thermoelectric module has a power rating of 68 W. It comprises of two ceramic plates attached to each other and two matched thermocouples connected in series across the plates. The ceramic plates form the heat sink and one of the thermocouples is used to measure the temperature, while the other is embedded inside the ceramic plate. These two metal plates act as the latent heat reservoirs, which transfer heat through the ceramic plates. Heat is transferred from one plate to the other in a thermal gradient, allowing for heat flow control.
In operation, an electric current is applied across the thermoelectric module, establishing a heat transfer from one plate to the other. This heat transfer is regulated by changing the applied voltages. This allows for the precise control of temperatures at any given time. The ET1.2-68-F1A thermoelectric module uses high-efficiency thermoelectric materials and direct-bonded ceramic plates for superior thermal performance. The direct-bonded technology provides excellent thermal conductivity while minimizing the thermal resistance of the module.
The ET1.2-68-F1A thermoelectric module is ideal for a wide range of applications where precise temperature control is required. This includes medical imaging, semiconductor testing, semiconductor fabrication, cryogenics, and heat- generating devices. This module offers superior performance and stability due to its low-impedance design and high-performance thermoelectric materials. This makes it suitable for applications such as cooling chips in high-end ICs, cooling power transistors, and driving heat pumps.
The ET1.2-68-F1A thermoelectric module is highly reliable and efficient due to its low-impedance design. The integrated heat sink helps to dissipate the heat generated by the module. This makes the module ideal for applications which require high heat transfer efficiency and long-lasting operation.
The ET1.2-68-F1A thermoelectric module is designed for easy assembly and operation and is UL recognized and RoHS compliant. It is also lead (Pb)-free and designed to meet industry standards for reliable operation. The thermoelectric module also comes with safety features such as thermal and over-temperature shutdown for optimal performance.
The ET1.2-68-F1A thermoelectric module is an excellent choice for applications requiring efficient heat flow control and consistent operation over a long lifetime. The low impedance design, high-efficiency thermoelectric materials, and integrated heat sink make it an ideal choice for a wide range of temperature sensitive applications. Its UL and RoHS compliance and superior thermal performance help to ensure reliable and safe operation.
The specific data is subject to PDF, and the above content is for reference
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