FH12-30S-0.5SV(55)

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When it comes to FPC (Flat Flexible) Connectors, FH12-30S-0.5SV(55) is an important product among them. It is a half-pitch FPC Connector from the FH Series. This product offers high performance, durability and cost effectiveness in a variety of applications.

FH12-30S-0.5SV(55) is often used in applications that require superior signal integrity. The product offers a superior customer experience through its user-friendly design and reliable performance. It has an 9.4mm pitch, a height of 4.0mm and a standard thickness of 0.5mm, making it suitable for applications with limited space.

The product features a low profile, low insertion force and a high mating force, making it easy to use. It is also resistant to dust and water, making it ideal for tough environments. The connectors have a low contact resistance and high insulation resistance, ensuring a reliable connection. The product\'s design also reduces cross-talking and signal noise.

The FH12-30S-0.5SV(55) has a low power consumption rate, making it energy efficient. It has a wide operating temperature range of -20 to +105 degrees C and a high cycle life of 5000. This makes it suitable for both high-volume production and long-term operations. The product\'s design also ensures quick and easy connection installation.

The versatile FH12-30S-0.5SV(55) is suitable for use in many industries, such as automotive, telecommunications, multimedia, computing and consumer electronics. It is also used in medical devices and in industrial automation processes. Some of the applications that FH12-30S-0.5SV(55) is used in include board-to-board connectivity, internal spacing, IC test and wiring.

FH12-30S-0.5SV(55) is a reliable FPC Connector that has been designed to provide superior performance and reliability. Its user-friendly design and low power consumption make it ideal for a variety of applications, including automotive, telecommunications, multimedia, computing and consumer electronics. It is also a cost effective solution for board-to-board connectivity, internal spacing, IC test and wiring.

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