| Allicdata Part #: | 603-1504-ND |
| Manufacturer Part#: |
FHS-A9025S17 |
| Price: | $ 6.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Delta Electronics |
| Short Description: | FAN CPU COOLER 90X19.1MM 12VDC |
| More Detail: | Heat Sink Intel LGA775 CPU Cooler Aluminum, Plasti... |
| DataSheet: |  FHS-A9025S17 Datasheet/PDF |
| Quantity: | 308 |
| 1 +: | $ 5.97240 |
| 10 +: | $ 5.47470 |
| 25 +: | $ 4.97700 |
| 50 +: | $ 4.60379 |
| 100 +: | $ 4.10602 |
| 250 +: | $ 3.91938 |
| Series: | FHS |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | Intel LGA775 CPU Cooler |
| Attachment Method: | Clip |
| Shape: | Round |
| Length: | -- |
| Width: | -- |
| Diameter: | 3.543" (90.00mm) OD |
| Height Off Base (Height of Fin): | 1.811" (46.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.64°C/W |
| Material: | Aluminum, Plastic |
| Material Finish: | -- |
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Thermal management has become increasingly important as electronic components and systems of greater complexity are developed. In order to maintain optimal performance while operating in harsh environments, the thermal loads need to be managed to ensure the longevity and reliability of the systems. The FHS-A9025S17 heat sink is a type of thermal management device used mainly in single board computers (SBCs). It is a thermally efficient, low-dissipation heat sink that offers excellent cooling performance in computing-intensive environments.
The FHS-A9025S17’s application field covers a wide range of industries, including manufacturing, military, aerospace and medical. It is particularly well-suited for high computing workloads, such as data centers, manufacturing automation equipment and internet of things (IOT) devices. It is also used in applications requiring high reliability and long-term performance, such as radiation-tolerant, air-grade, and aerospace applications.
The FHS-A9025S17 works using three distinct principles. The first principle is passive cooling, which is achieved by using a series of fins and pins to dissipate the heat away from the core surface. This fin and pin design is optimized to maximize heat transfer away from the sources of heat and consequently, provide maximum cooling.
The second principle is convection cooling. This is achieved by airflow from natural convection or fan-driven forced convection. The airflow circulates and disperses the heat away from the source. In addition, convection cooling increases as the fins are designed in thinner thickness while providing optimized contact area for efficient heat sink performance.
The third principle is thermal conduction, where the heat is transferred from the source to other heat sinks or supporting surfaces. The FHS-A9025S17 heat sink features a built-in thermal interface material (TIM) that assists the thermal conduction between the heat sink and the heat source. It also has a built-in mounting adapter to ensure effective and reliable interconnects between the application board and the heat-generating components.
In summary, the FHS-A9025S17 heat sink excels in thermal management and is suitable for single board computers (SBCs) in plenty of applications, i.e. manufacturing, military, aerospace and medical. The design maximizes heat dissipation and employes the three principles of passive cooling, convection cooling and thermal conduction to achieve optimal cooling performance.
The specific data is subject to PDF, and the above content is for reference