FPSLDLD045ML3SW

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FPSLDLD045ML3SW (Focused Plasma Sputtering Diode with Low Damage-Low-Drift Multi-Layer Substrate Window) is a new type of advanced material processing technology with the capabilities of both physical and chemical vapor deposition (PVD and CVD), and subpixel addressing. It is commonly used in the manufacture of specialized optical components, LED surfaces and nanostructured films.

This technology is capable of controlling the substrates and surface size of complex and difficult-to-manufacture materials such as photoresist, opal, indium tin oxide, aluminum, gallium arsenide, copper, and nickel. In particular, it is used for making thin-film optical components, LEDs, and conductive films.

The operating principle of this technology is based on a low damage-low-drift multi-layer substrate window. This substrate window is composed of a double-layer metal film which when combined with a diode laser and focused plasma sputtering deposition, creates a high-density plasma. This high-density plasma is then focused into a defined target area by the use of an electric field. Once focused, particles from the high-density plasma travel towards the substrate, which undergoes a sputtering reaction. This reaction causes the substrate to undergo a controlled and uniform deposition process.

This process can be used to create an optimal thin-film layer on sensitive substrates. By controlling the electric field, the film quality can be controlled independently of the substrate thickness. The controlled and uniform deposition ensures quality and consistency in the thin-film structures, which is critical for applications such as LED covers and nanostructured films.

FPSLDLD045ML3SW technology is also used for glass bonding and non-destructive testing. The sputtering process during glass bonding results in strong adhesion of the glass layers and any underlying material without the need for add-on adhesives or thermal treatment. For nondestructive testing, the laser and electric field can be adjusted to different energy levels to detect the integrity and defects of a material.

In summary, Focused Plasma Sputtering Diode with Low Damage-Low-Drift Multi-Layer Substrate Window is a versatile material processing technology with the capability of physically and chemically depositing materials on substrates. It is used for making thin-film optical components, LEDs, conductive films, and nanostructured films. Glass bonding and nondestructive testing are other applications of this technology. Its operating principle is based on a double-layer metal film combined with a diode laser and focused plasma sputtering deposition which creates a high-density plasma.

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