FX18-80S-0.8SV15 Connectors, Interconnects

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FX18-80S-0.8SV15 is a mezzanine type of rectangular connector which is best used to provide permanent electrical connections between two boards. Mezzanine connectors are generally used in products where boards are stacked one on top of the other, such as in high-end consumer electronics, aerospace, and medical applications. As such, this type of connector is ideal for applications that require high density packaging and fast connection.

The FX18-80S-0.8SV15 features two rows of 0.8mm thick pins, each with 18 pins, which provide a total of 36 connection points. The pins feature selective plating, where different parts of the pins can be plated with different materials. This provides improved wear and tear on the pins and ensures a more reliable connection overall. The pins are also stamped with long tails, allowing for easy soldering and assembly.

The connector’s header consists of two sets of legs in a staggered design. This allows the connector to be mounted to the board with higher strength than a standard header design, making it suitable for a wide range of applications. The header is complete with polyimide-sealed leads which provide increased cable strain relief and improved longer-term performance.

This connector also provides an additional feature which is an increased footprint. The larger contact area increases the surface area for electrical contact, further improving connection reliability. The connector also features a metal shell which provides a high degree of protection, and it is able to redirect heat away from sensitive components. The shell also helps reduce EMI (Electromagnetic Interference).

The FX18-80S-0.8SV15 is a versatile, robust connector that is ideal for applications in the automotive, aerospace, medical, and consumer electronics markets. In these applications, it can be used to connect two boards in a stacked configuration for increased connection stability and improved protection. Its large footprint and metal shell make it suitable for high-density packaging requirements and provide optimal performance in demanding environments.

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