FX20-100S-0.5SV

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The FX20-100S-0.5SV belongs to the family of rectangular connectors, arrays, edge type, mezzanine (board to board) connectors. This type of connector is commonly used to provide high-speed direct interconnections between two boards. It is often used in applications that require a signal, power or data connection usually between two circuit boards. It is an effective and reliable alternative to traditional wire-based interconnects.

The FX20-100S-0.5SV is designed with a housing of 0.65mm nominal height and 1.05mm nominal width. The connector complies with the EU RoHS Directive (2001/95/EC) and is RoHS compliant, providing its users with a high-level of electrical performance. The product uses contacts of 922.5um nominal diameter. It is a two-row connector with 1.0mm pin intervals. The connector is terminated with soldering for circuit boards.

The FX20-100S-0.5SV supports the high-speed differential signal that is required for high-speed transmission for long-range transmission. It also has a low contact resistance to reduce the signal degradation and ensure a quality connection. This connector also has a higher current capability than other connectors, allowing it to support higher current applications. The FX20-100S-0.5SV features low crosstalk between the two rows of pins, which helps maintain signal integrity across the connection.

The FX20-100S-0.5SV works by providing pathways between the two boards that allow signals to travel from one board to the next. The signal is sent by applying voltage between the two related pins via the contacts. The contacts form a secure connection which allows the signal to travel through the connection without interference. The connector is designed to ensure a secure physical connection between the two boards, which can reduce electrical noise and improve signal quality.

The FX20-100S-0.5SV is designed to provide superior performance in applications that require the transfer of high-speed, high power data from two boards. It can be used in a wide variety of applications, such as communications systems, notebooks, control systems, displays, automotive electronics, and medical devices. The built-in features, such as its low contact resistance and contact-packaging design, make it an effective and reliable choice for demanding high-speed, high-power applications.

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