FX23-80S-0.5SV10

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FX23-80S-0.5SV10 connectors are designed as an edge-type, mezzanine-style board-to-board device. These connectors reside in the rectangular array, which comprises a grouping of similarly configured pins that are usually linked together into a row or vertical array, and are housed in a linear, one-piece, machine-made molded plastic body. The main feature of the FX23-80S-0.5SV10 is its high-density design, allowing for high-speed signal transmission between two interconnected mezzanine boards.

The FX23-80S-0.5SV10 is used primarily for interconnecting mezzanine boards in a wide range of applications. For example, the device can be used to interconnect test and measurement systems, fast data acquisition and control systems, communication and imaging systems, gaming systems, and many other industrial environments.

The FX23-80S-0.5SV10 uses a low-profile, low-slew rate, 0.5SV10 power signaling format, allowing high-speed signal transmission. The device is designed with a comparably low profile, allowing more signal pairs to fit into a limited space. Additionally, each signal pair is spaced in a 0.5mm pitch, enabling high-speed transmission.

The FX23-80S-0.5SV10 operates using an array of contact terminals, which allow for reliable electrical connection between the two mezzanine boards. The terminals are soldered into the edge connector and are located on the bottom of the connector body. Additionally, the connector is constructed with a chevron-style center contact that is machined from a single piece of metal for reliable contact and uniform mechanical and electrical characteristics.

The FX23-80S-0.5SV10 is comprised of a cross-linked, thermoplastic elastomer molded body that offers superior dust protection, moisture protection, and thermal stability. The device is also designed with high-temperature, gold-plated contacts to ensure reliable performance. Additionally, the connector features multiple mounting holes, allowing for easy and secure installation.

In conclusion, the FX23-80S-0.5SV10 is a reliable, low-profile, high-density mezzanine-style board-to-board connector that facilitates high-speed signal transmission and is typically used in a variety of industrial applications. With its low profile and high-temperature contacts, the device provides a safe and reliable solution for interconnecting mezzanine boards.

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