GL092F35CET Allicdata Electronics
Allicdata Part #:

GL092F35CET-ND

Manufacturer Part#:

GL092F35CET

Price: $ 0.22
Product Category:

Crystals, Oscillators, Resonators

Manufacturer: CTS-Frequency Controls
Short Description: CRYSTAL 9.216000 MHZ SMD
More Detail: 9.216MHz ±30ppm Crystal 20pF 60 Ohms HC-49/US
DataSheet: GL092F35CET datasheetGL092F35CET Datasheet/PDF
Quantity: 1000
1000 +: $ 0.20160
Stock 1000Can Ship Immediately
$ 0.22
Specifications
Series: ATSSMGL
Packaging: Tape & Reel (TR) 
Part Status: Active
Type: MHz Crystal
Frequency: 9.216MHz
Frequency Stability: ±50ppm
Frequency Tolerance: ±30ppm
Load Capacitance: 20pF
ESR (Equivalent Series Resistance): 60 Ohms
Operating Mode: Fundamental
Operating Temperature: -20°C ~ 70°C
Ratings: --
Mounting Type: Surface Mount
Package / Case: HC-49/US
Size / Dimension: 0.461" L x 0.197" W (11.70mm x 5.00mm)
Height - Seated (Max): 0.169" (4.30mm)
Description

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GL092F35CET Application Field and Working Principle

Encapsulates that are used in various industrial and commercial settings, such as automotive, aerospace, and medical industries, are known as GL092F35CET. These encapsulate are often made of ceramics such as alumina (Al2O3) and silicon nitride, and they are most commonly used to package and protect electronic components. The main purpose of GL092F35CET encapsulates is to protect these components from the hostile environment in which they are placed.

The main features of GL092F35CET encapsulates include a low coefficient of thermal expansion, high dielectric strength, and small dimensions. These features make these encapsulate very useful in extremely harsh conditions. Additionally, these encapsulate can be machined to tight tolerances and can withstand a wide range of temperatures.

The working principle of GL092F35CET is based on the principles of dielectric strength and thermal expansion. First, the dielectric strength of GL092F35CET is determined by measuring the resistance of the material when it is exposed to an electric field. The electric field strength and the electric field direction determine the level of dielectric strength that the material can sustain.

Second, the coefficient of thermal expansion of GL092F35CET is used to measure the thermal properties of the material. This term indicates the rate at which a material changes its dimension due to a change in temperature. This feature of GL092F35CET materials makes them ideal for applications in extreme temperatures because the materials can maintain the same dimensions in different environments.

Finally, the dimension size of GL092F35CET is important for packaging and protecting electronic components. The size of GL092F35CET allows for the packaging of numerous components within a small space, allowing for efficient performance in industry applications. For example, a device packed within a GL092F35CET encapsulate requires a smaller footprint than one that is packed in a larger encapsulate.

GL092F35CET encapsulate offer several advantages to users. These encapsulate provide protection against environmental damage, a low coefficient of thermal expansion, and a small size. Additionally, these encapsulates have a high dielectric strength and can be machined to tight tolerances. As a result, GL092F35CET encapsulate are ideal for use in harsh conditions and industrial applications.

The specific data is subject to PDF, and the above content is for reference

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