HIF2B-20D-2.54RA

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The HIF2B-20D-2.54RA is one of the Rectangular Connectors - Board In, Direct Wire to Boards. It is a versatile, reliable, and secure electrical connection device that can be used in a wide variety of applications. The HIF2B-20D-2.54RA has a wide variety of features that make it suitable for industrial applications.

The HIF2B-20D-2.54RA features a 0.2 mm pitch, raised phos bronze contacts for improved surface contact and water resistance, and a high insulation resistance. It also has a dual row of 2.54 mm pin spacing. The HIF2B-20D-2.54RA has a contact resistance of 25m Ω max and an insulation resistance of 500VAC/V DC. It can also withstand a temperature range of -55°C to +105°C.

The HIF2B-20D-2.54RA is used in a variety of industrial applications, ranging from computer and peripheral devices to medical and aerospace applications. It is ideal for applications that require reliable and secure electrical connections over extended temperatures and with a contact resistance of 25m Ω max. It is suitable for use in a wide range of applications that require tight tolerances and absolute reliability.

The HIF2B-20D-2.54RA has a working principle that is relatively simple. In a nutshell, this device is designed to be installed by creating a gap between two plastic shells that can then be connected together using a solder process. When the two shells have been connected, the resulting connection is strong and reliable. This allows for the device to remain secure while still providing good contact strength and high insulation resistance over extended temperatures.

The HIF2B-20D-2.54RA is an ideal connector for applications that require a reliable and secure electrical connection device. It is a cost effective device that can withstand a wide range of temperature ranges. Furthermore, its dual row of 2.54 mm pin spacing and raised phos bronze contacts help to ensure a secure and reliable connection. It can also be used in a variety of industrial applications, ranging from computer and peripheral devices to medical and aerospace applications.

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