HM1F51FDP000H6LF

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Backplane connectors are a specialized type of connection used in computers and their peripherals. These are thick cables with multiple connectors on each end, which are used to carry signals between different components of a computer. The HM1F51FDP000H6LF is a backplane connector made by Hirose Electric Co., Ltd.

The HM1F51FDP000H6LF is widely used in many applications, such as the automotive, avionics, medical, communications, and industrial fields. It can be used as a general-purpose connector as well as in high-speed applications, such as DDR3, DDR4 and PCIe. The connector is also used in applications where a small size and high heat resistance are needed, as in high-density LED board and base station applications. The HM1F51FDP000H6LF also has superior performance in terms of electrical properties.

The HM1F51FDP000H6LF is a high-density connector with a 1.5mm pitch and a total of 51 pins. This connector is designed to be used with a housing and can be mounted onto a flat surface such as a backplane. It is composed of an upper contact, lower contact, and a locking mechanism. The upper contact is made of gold plated copper, which can handle high-frequency signals without interference. The lower contact is made of phosphor bronze, which provides reliable mating performance and is inserted into a plastic housing. The locking mechanism ensures secure connection and prevents accidental disconnection.

The working principle of the HM1F51FDP000H6LF is based on the fact that when an electrical signal passes through a conductor, it produces a magnetic field around the conductor. This magnetic field induces a voltage in the conductor, which in turn creates a current. The HM1F51FDP000H6LF takes advantage of this working principle by creating a magnetic field in the connector, which can be used to induce a voltage in a circuit. This voltage is then used to power the circuit and transfer data between components.

The HM1F51FDP000H6LF is a reliable and versatile backplane connector that is used in many different applications. Its high-density design allows for a greater amount of data to be transferred, and its robust locking mechanism ensures secure connections. Its superior performance makes it suitable for a wide range of applications where a small size and high heat resistance are needed.

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