HM2DK1235PLF Allicdata Electronics
Allicdata Part #:

HM2DK1235PLF-ND

Manufacturer Part#:

HM2DK1235PLF

Price: $ 0.41
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC DISCR KEY PLUG
More Detail: N/A
DataSheet: HM2DK1235PLF datasheetHM2DK1235PLF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1000 +: $ 0.38102
Stock 1000Can Ship Immediately
$ 0.41
Specifications
Series: Millipacs®
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Accessory Type: Coding Keys
For Use With/Related Products: MilliPacs®
Specifications: Green
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are the interconnects between components within a board or system, and serve as an essential element of computer bus and network designs. Among backplane connectors, HM2DK1235PLF connectors are commonly used for high-speed I/O and power applications in telecommunications, medical, transportation, consumer, and industrial end-products. These connectors have exceptional cost, signal integrity, power, and reliability, making them ideal components for any kind of application.

The HM2DK1235PLF is a family of high-density, high-performance inline board-mount connectors designed for use in a wide variety of applications. They feature a paddle frame and a fractal housing which allows for a high degree of design flexibility. With pin density of 2.54mm and maximum density of 6.35mm, these connectors provide the best balance of space-saving capacity and design freedom. They deliver superior signal integrity, power efficiency, and mechanical reliability, with excellent performance in reduced form factor applications. They also provide easy deployment with a consistent and easy-to-use design.

HM2DK1235PLF Application Field

HM2DK1235PLF connectors are ideal for applications requiring space-saving design, such as low-profile embedded systems, displays, servers, storage systems, personal computing, telecommunications, networking, and automotive. They are also suitable for applications ranging from medical equipment to networking and storage equipment.

In addition, these connectors are also suitable for data centers, industrial automation, and robotics, providing reliable connections and data transmission with superior power efficiency. With higher levels of flexibility, speed, and durability, they are an ideal choice for a wide range of applications.

HM2DK1235PLF Working Principles

The HM2DK1235PLF connectors use a plated through-hole (PTH) contact system, which offers low contact resistance and long connector life. These contacts are designed for high-speed mating, and they are held in place by a paddle frame that fits tightly into the mating connector’s enclosure. The connectors also have an integral retainer that locks the mating contact in place, ensuring reliable and secure connections.

These connectors have multilevel shielding and noise suppression, which helps reduce Electromagnetic Interference (EMI) emissions, and also provides maximum contact force between contacts for reliable signal transmission. This is beneficial for applications in higher speed networks, allowing for higher data throughput without compromising system integrity.

In addition, the HM2DK1235PLF also has an insertable crimp system that allows for effortless assembly, and the connector’s design also reduces component-mount time. Furthermore, the connector has an integral strain relief system that ensures strain relief for the wires used in the connection, as well as a ground strap that helps further reduce EMI emissions.

Overall, the HM2DK1235PLF connectors are designed for reliable, high-speed performance in a wide range of applications. With excellent power efficiency, superior signal integrity and reliability, these connectors are ideal for low-profile embedded systems, displays, servers, storage systems, personal computing, telecommunications, networking, and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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