HM2DK1367RLF

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Backplane connectors are a type of electrical interconnect used to connect two different printed circuit boards. They provide a high-density connection between boards, with standardized systems for board-level modularity, despite a much higher cost than a single-board solution. In the technology world, the use of backplane connectors is growing rapidly due to its many advantages. One of the most popular types of backplane connectors is the HM2DK1367RLF. This article will discuss the application field and working principle of this connector.

Application Field

HM2DK1367RLF is a connector designed for applications which require high density and high speed data transmission. It is a high-reliability product widely used for telecommunications, networking, data storage equipment, IT server, and military platforms. It provides up to 12Gb/s of data rate which allows for faster and more reliable data transmission.

The HM2DK1367RLF is also suitable for applications which require a high heat dissipating capacity. Its unique design provides excellent thermal dissipation and helps reduce component heating, resulting in longer product life. Additionally, this connector offers EMI shielding, making it suitable for applications which demand a stable signal transmission environment. It is also a cost-effective solution for many applications as it reduces labor cost for assembly significantly.

Working Principle

HM2DK1367RLF is a high-density, high-speed connector with a heavy-duty rugged construction. It offers a modular design which enables easy maintenance and update for new systems without requiring complete replacement of the existing system.

The working principle of HM2DK1367RLF is based on a unique tilt-lock mechanism. This mechanism provides a secure contact between the contacting points, reducing electrical losses and ensuring a stable connection. The connector features a proven mating system which offers positive latching action and ensures a robust connection between the two systems and components.

The connector features an insert-molded strain relief which helps to reduce cable bending stresses and protect against regular wear and tear. It also offers cable retention feature which helps protect the cable from displacement or damage, making it suitable for high-vibration environments. Furthermore, an overmolded housing design ensures structural integrity and helps reduce the overall connector size.

Conclusion

HM2DK1367RLF is a high-density, high-speed connector offering a modular design which enables easy maintenance and update for new systems without requiring complete replacement of the existing system. It is suitable for applications which require high heat dissipating capacity, EMI shielding, and cost-effectiveness. Its unique tilt-lock mechanism provides a secure contact between the contacting points, reducing electrical losses and ensuring a stable connection.

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