HM2G07

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Backplane Connectors - Accessories

HM2G07 is a cost-effective, purpose-built backplane connector, designed for high-speed and high-throughput applications. By relying on the use of advanced engineering techniques such as hybridization and gallium nitride (GaN) transistors, it enables the most efficient power and signal management in the industry. Its innovative design greatly reduces the number of plastic parts while providing a comprehensive suite of non-standard ports for in-circuit and in-system connection. It is highly versatile, with the ability to be applied in both pre-terminated and re-wireable methods.

HM2G07\'s primary application field is in the high-performance backplane computing, telecommunications, automotive, and automation markets. It is also relevant for industrial automation systems, consumer electronics, and industrial automation applications. It is well-suited to support next-generation applications, ranging from mil-aero to military communications to medical equipment, where large data throughput must take place in tight spaces.

As with any backplane connector, the main purpose of HM2G07 is to provide an efficient connection between two or more devices. This connection may or may not be directly wired. Its architecture is a modular solution that provides the flexibility to match a variety of different technologies for usage in a wide variety of applications. For example, HM2G07 can support multiple layer stacking, up to 25 layers, or a combination of any material with a variety of length (from sub-100mm up to 400mm). It also offers a range of mounting options and a number of special ports.

The working principle behind the HM2G07 is based on signal and power management. As with any backplane, electricity and data need to be managed in order to ensure that they are properly distributed. The HM2G07 uses hybrid construction and high-density arrays of pins to achieve this level of control. By efficiently distributing the power and data, the resource requirements for a system can be drastically reduced and it can be implemented on a smaller scale than previously possible.

The contact elements of HM2G07 are composed of two layers (dual-layer) of dense array of signal pins and two layers of power pins. This arrangement maximizes the surface area available for signal transmission and enables efficient communication of power and data in compact spaces. Furthermore, using a combination of a gold-plated, nickel-zinc-plated, or copper-plated pin and a specially formulated lubricant, the HM2G07 enables a highly reliable, dust-resistant connection.

Apart from a reliable connection, the HM2G07 also offers an impressive range of additional features. This includes a wide voltage range, flexible power rating, and a low-power mode for flexibility in power management. Additionally, its floating architecture ensures that each signal can use its own independent voltage, making it extremely resistant to electromagnetic interference. Finally, the enclosed design of the HM2G07 prevents any airborne dust or dirt from entering the connector cavity, which further improves its reliability.

In summary, the HM2G07 is a highly versatile, powerful, and durable backplane connector that offers the best in power and signal management. By relying on advanced engineering techniques such as hybridization and gallium nitride (GaN) transistors, it enables the most efficient power and signal management in the industry. Its innovative design minimizes the number of plastic parts while providing a comprehensive suite of non-standard ports for in-circuit and in-system connection. Additionally, its gold-plated, nickel-zinc-plated, or copper-plated pin and a specially formulated lubricant ensure a reliable, dust-resistant connection.

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