Allicdata Part #: | HM2P07PDE2A1N9-ND |
Manufacturer Part#: |
HM2P07PDE2A1N9 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | MPAC 5R ST PF HDR |
More Detail: | 154 (110 + 44 Ground) Position Header, Male Pins C... |
DataSheet: | HM2P07PDE2A1N9 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | Millipacs® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Header, Male Pins |
Connector Style: | A 22 |
Number of Positions: | 154 (110 + 44 Ground) |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 + 2 |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Current Rating: | 1.5A |
Voltage Rating: | 750Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | Board Guide |
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Backplane Connectors - Hard Metric, Standard - enable communication and transfer of power between two printed circuit boards (PCBs). This type of connector typically has pins on both sides of the board for improved conductivity. Connectors of this type are commonly used in electronics, automotive, military and medical applications. The HM2P07PDE2A1N9 is a high-performance backplane connector with four signal pins, four ground pins and one power pin, making it ideal for a wide range of applications.
The HM2P07PDE2A1N9 connector has a maximum voltage rating of 250V and a current rating of 2A, with an insulation resistance of 200MΩ. It has a contact electrical life of up to 1000 cycles and a contact retention force of 0.6N minimum. The signal lines terminate in a special style of sliding contacts, enabling a space saving design. The connector also has a good temperature range of -40°C to 125°C. This makes the HM2P07PDE2A1N9 suitable for various harsh environments.
HM2P07PDE2A1N9 is widely used in applications where high performance and high reliability are critical. It is commonly used in medical equipment, military systems, robotics, and automotive power control systems. It is also used in data communication systems, telecommunications systems, industrial controls, and electronic instrumentation.
The HM2P07PDE2A1N9 is designed to provide reliable connection between multiple parallel boards, which are often stacked in an assembly. Its features also make it suitable for use in other backplane systems. The connector can be used to join different systems with different electrical requirements and operates efficiently and reliably in even the most extreme environments.
The backplane connector works by providing a low-impedance connection between two PCBs. This low-impedance connection ensures signals across the antenna-to-baseband interface are without distortion and are not attenuated. Furthermore, the connection between the two parts is highly reliable and resistant to noise interference, providing a stable signal transmission between the two parts. When installing the connector, a special tool is used to ensure a secure and reliable contact between the two boards.
In addition, the HM2P07PDE2A1N9 is designed with a unique locking feature that ensures vibration and shock resistance. Furthermore, the connector is equipped with EMI/ground shield that helps to reduce interference of electromagnetic radiation on neighboring conductors or electronic circuits on nearby systems. Finally, the HM2P07PDE2A1N9 also provides a heat dissipation feature to keep the connector cool.
The HM2P07PDE2A1N9 is a high performance backplane connector which combines reliability with signal transfer. It is suitable for a wide range of applications from medical equipment, to military systems, and telecommunications. In addition to its reliable electrical performance, its unique locking mechanism and EMI/ground shield make it capable of withstanding harsh environments and providing improved signal transfer across the board connections.
The specific data is subject to PDF, and the above content is for reference
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