| Allicdata Part #: | HM2P08PKF1G0GFLF-ND |
| Manufacturer Part#: |
HM2P08PKF1G0GFLF |
| Price: | $ 2.35 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Amphenol FCI |
| Short Description: | MPAC 5R ST PF HDR |
| More Detail: | 125 Position Header, Male Pins Connector 0.079" (2... |
| DataSheet: | HM2P08PKF1G0GFLF Datasheet/PDF |
| Quantity: | 1000 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| 1152 +: | $ 2.12773 |
| Series: | Millipacs® |
| Packaging: | Tray |
| Lead Free Status / RoHS Status: | -- |
| Part Status: | Active |
| Moisture Sensitivity Level (MSL): | -- |
| Connector Type: | Header, Male Pins |
| Connector Style: | B 25 |
| Number of Positions: | 125 |
| Number of Positions Loaded: | All |
| Pitch: | 0.079" (2.00mm) |
| Number of Rows: | 5 |
| Mounting Type: | Through Hole |
| Termination: | Press-Fit |
| Connector Usage: | -- |
| Contact Finish: | Gold |
| Contact Finish Thickness: | 30.0µin (0.76µm) |
| Voltage Rating: | 750Vrms |
| Operating Temperature: | -55°C ~ 125°C |
| Features: | -- |
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The vast majority of backplane connectors used today are 60-pin and 84-pin Hard Metric components. HM2P08PKF1G0GFLF is one such component that serves many different purposes in a variety of electronic applications. Its rugged construction and versatility make it particularly suitable for high-density applications that require dense, reliable connections between boards or between an enclosure and FSMs.
The HM2P08PKF1G0GFLF is a low-profile connector that is designed for high-speed signal transmission and routing. It is rated for up to 8 Gigabits per second and has a wide array of power, ground and signal pins that are spaced closely together to reduce crosstalk and maximize signal integrity. The connector is made of corrosion-resistant brass and a tin-plated finish and features thermally bonded insulators to help protect against accidental shorts. Its simple design makes it versatile enough to be used in anything from telecoms applications to consumer electronics.
The hard-metric standard of backplane connectors is characterized by its array of small pins, which form a tight connection between the boards or enclosures. This is made possible by a unique contact system, where a series of cylindrical pins sync with axially-aligned slots on the mating side of the connector. This arrangement ensures reliable contact between connections and helps to prevent movement and wear due to vibration or other external forces. It also helps to isolate the connections from nearby signal paths in order to reduce crosstalk and maximize signal integrity.
The HM2P08PKF1G0GFLF has many features that make it well suited to various high-density applications. It is a low-profile design, which means it can be used in tight spaces without sacrificing signal integrity. Its thermally bonded insulators also provide additional protection against accidental shorts. Additionally, the connector’s brass construction and tin-plated finish help to protect the connector from corrosion in harsh environments.
In addition to high-density applications, the HM2P08PKF1G0GFLF can be used in other applications where reliability and durability are key. It is a great choice for applications in extreme temperatures and environments, such as in aerospace and communications. The hard-metric standard is also widely used in data networking and digital audio applications, especially those that require high speed, reliable connection and signal integrity.
In short, the HM2P08PKF1G0GFLF is a highly versatile backplane connector with many features that make it suitable for a wide range of applications. Its rugged construction, versatility, and Hard Metric standard make it particularly suitable for high-density applications in which reliable connections and signal integrity are essential.
The specific data is subject to PDF, and the above content is for reference
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HM2P08PKF1G0GFLF Datasheet/PDF