HM2P08PKF1K9GF Allicdata Electronics
Allicdata Part #:

HM2P08PKF1K9GF-ND

Manufacturer Part#:

HM2P08PKF1K9GF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 5R ST PF HDR
More Detail: 175 (125 + 50 Ground) Position Header, Male Pins C...
DataSheet: HM2P08PKF1K9GF datasheetHM2P08PKF1K9GF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: B 25
Number of Positions: 175 (125 + 50 Ground)
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5 + 2
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are designed to provide electrical, mechanical and thermal connections between multiple printed circuit boards (PCBs) in a rack-based system. Hard metric family is the highest performance family of connectors available on the market today. HM2P08PKF1K9GF, with its integrated differential signaling, is a part of this family.

The HM2P08PKF1K9GF connector consists of two modular headers and receptacles with two positions each. The various mating and unmating features of HM2P-type connectors provide circuit board designers flexibility in terms of connector body size and contact layout. The housings are made of black UL94V-0 acid and chemical resistant plastic. The HM2P08PKF1K9GF allows 1.3mm-2.1mm stack height to be achieved between two connected boards, enabling designers incredible versatility in schematic design.

With its integrated differential signaling, the HM2P08PKF1K9GF connector offers superior performance in terms of signal integrity and electrical assurance when compared to traditional hard metric connectors, which only use single-ended signals for data transmission. The incorporated differential signal capability provides the connector with greater immunity to EMI and improved signal integrity in high-speed interconnections.

The standard contact layout includes different kinds of contacts that are designed to provide different electrical functions. U-contacts provide power connections, while F- and E-contacts provide signal and ground connections. In addition, the HM2P08PKF1K9GF is capable of carrying larger current capacities than the other hard metric connectors. The resulting combination of high-speed operation and high current density make HM2P08PKF1K9GF the ideal choice for challenging high-density board-to-board connections.

The HM2P08PKF1K9GF is also designed for real-time connection and disconnection with other mating connectors. This ensures greater flexibility in terms of power cycling, or the need to quickly transfer power from one device to another. The robust design of the contacts also allows for reliable operation in more extreme operating conditions.

The HM2P08PKF1K9GF is the perfect combination of operating speed, current signaling, power capacity, contact density and reliability. It is ideal for applications such as high-speed board-to-board interconnects, controlled impedance, LAN and multimedia applications, industrial controller networks, and telecommunications switching systems. It is also ideal for connecting one PCB to another PCB in cramped spaces due to its small size.

In conclusion, the HM2P08PKF1K9GF offers improved signal integrity and reliability in demanding applications. It provides a high-speed, reliable, and robust solution for multiple applications. With its integrated differential signaling and versatility in term of connector body and contact design, it is the ideal choice for challenging high-density board-to-board connections.

The specific data is subject to PDF, and the above content is for reference

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