HM2P09PDE3W0N9 Allicdata Electronics
Allicdata Part #:

HM2P09PDE3W0N9-ND

Manufacturer Part#:

HM2P09PDE3W0N9

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 5R ST PF HDR
More Detail: 55 Position Header, Male Pins Connector 0.079" (2....
DataSheet: HM2P09PDE3W0N9 datasheetHM2P09PDE3W0N9 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: C 11
Number of Positions: 55
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: Board Guide
Description

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Hard Metric, Standard connectors are a family of high speed interconnect systems and are available in many different versions for various applications. HM2P09PDE3W0N9 is one particular type of this connector family. These connectors offer exceptional electrical performance and featurea sturdy construction.

The HM2P09PDE3W0N9 is a robust backplane connector used in high speed applications, such as communication networks and industrial automation equipment. It features various contact configurations, including gold plated contacts, to meet the requirements of the application. The connector’s low profile design allows for a high backplane current density, while maintaining a safe distance between contact pins. They have a proven reliability with a low failure rate.

The HM2P09PDE3W0N9 connector is compatible with standard backplane connectors. It provides good impedance matching in high speed applications, and allows for improved integrity of data transmission in systems with high frequency signals. It can be used to transfer data, power or both simultaneously, and has a maximum data rate of up to 80 Gb/s. It offers excellent signal integrity and contact reliability.

When it comes to applications that require transfer of power, the HM2P09PDE3W0N9 has a higher current rating than most other connector types. It can safely handle up to three amps of current, so it is suitable for use in industrial automation equipment and other power-sensitive applications. The contacts are plated with gold, which helps to increase the connector’s life expectancy.

The HM2P09PDE3W0N9 connector is designed to work with the most common backplane configurations, making it easy to install in existing systems without the need for any additional components. It also provides excellent shielding against signal interference and cross talk. The contacts are also spring-loaded to provide a secure connection, which helps reduce the risk of data loss or disruption.

The working principle of the HM2P09PDE3W0N9 connector is based on the concept of signal transmission. The connection between two pins is established through a combination of electrical energy, dielectric, and magnetic fields. By applying an electrical force to the contacts, the fields are directed to the contact areas, and an electrical current is produced. This current creates a magnetic field, which then transfers the data from the contacts, through the connector. In turn, this data is transferred through the backplane to the other components within the system.

The HM2P09PDE3W0N9 connector is designed to achieve optimal signal integrity and contact reliability, and provide an effective interconnect solution for high speed applications. Its gold plating helps to reduce the risk of corrosion, which can otherwise lead to signal interference. It can be used to transfer data, power or both, and is compatible with other backplane connector systems. Overall, the HM2P09PDE3W0N9 is a highly reliable connector that provides excellent performance for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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