HM2P09PK5118GFLF Allicdata Electronics
Allicdata Part #:

HM2P09PK5118GFLF-ND

Manufacturer Part#:

HM2P09PK5118GFLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: MPAC 5R ST PF HDR
More Detail: 77 (55 + 22 Ground) Position Header, Male Pins Con...
DataSheet: HM2P09PK5118GFLF datasheetHM2P09PK5118GFLF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
0 +: $ 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Millipacs®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Preliminary
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: C 11
Number of Positions: 77 (55 + 22 Ground)
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5 + 2
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 750Vrms
Operating Temperature: -55°C ~ 125°C
Features: Board Guide
Description

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Backplane Connectors are a type of electrical connectors used to connect two pieces of equipment together. The Hard Metric, Standard HM2P09PK5118GFLF is one such connector. It is a high-performance, pin-and-socket, board-to-board interconnect solution with press-fit contacts.

The HM2P09PK5118GFLF backplane connector offers dual-port configuration for increased signal speed and power density. With its dual port configuration, the HM2P09PK5118GFLF can be used for server backplanes, as well as for a variety of rack-mounted systems. It also provides flexibility for applications requiring asymmetrical signaling, such as CPU stacking.

The HM2P09PK5118GFLF is an ideal solution for high-performance applications such as server backplanes, storage systems, instrumentation, and avionics. It also provides superior signal integrity and EMI performance. This is due to its unique design, which includes optimized contact geometries, press-fit technology, and gas-tight sealing.

In terms of performance, the HM2P09PK5118GFLF is capable of handling up to 8 Gbps data transfer speed, 20 Gbps Ethernet-type overhead signaling, and 12 Gbps OIF PCIe 3.0 signals. Its superior shielding is also suitable for operating signals in the 23 to 30 GHz frequency range.

The HM2P09PK5118GFLF is mainly used in high-speed, densely populated, server backplane applications. It is used to provide reliable interconnections between system components, such as servers, storage systems, and communications fabrics. This type of connector offers a reliable solution with minimal maintenance.

The HM2P09PK5118GFLF is also suitable for reliable operation in avionic, automotive and medical applications. Its use can also be found in data centre applications, where its small size and high performance render it the perfect choice. Due to its low profile design, the HM2P09PK5118GFLF is also preferred in applications where there is limited space.

The HM2P09PK5118GFLF works on the principle of press-fit technology. This is where two surfaces are pressed together, rather than simply held together. The press-fit technology ensures a secure connection between the two surfaces, as well as providing a low profile solution. This ensures a reliable connection that is resilient to shock, vibration, and other environmental hazards, while minimizing the chances of signal interference.

HM2P09PK5118GFLF backplane connectors are a high-performance, cost-effective, and reliable solution for driving signals between boards in a variety of applications. With its robust construction, superior shielding, and press-fit technology, this connector provides a reliable connection that can withstand extreme conditions. Its small size and high performance make it an ideal choice for applications requiring high signal speeds in a compact form factor.

The specific data is subject to PDF, and the above content is for reference

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